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The KBU2504-G is a bridge rectifier manufactured by Comchip Technology, designed for general-purpose power supply applications. This component utilizes silicon epitaxial planar technology and features an epoxy molding compound rated UL94-V0 for flame retardancy. It operates with a maximum repetitive peak reverse voltage of 400 V and provides a continuous average forward rectified current of 2 A. The device supports a non-repetitive peak forward surge current of 35 A under specified conditions. Electrical characteristics include a maximum RMS reverse current of 10 µA at 400 V and a maximum DC blocking current of 25 µA. The unit is housed in the KBPC package style and complies with RoHS standards.
Verify compliance with RoHS directives and confirm the specific manufacturer datasheet version before procurement. Ensure the ordering suffix matches the required lead-free specifications. Cross-reference the KBPC package dimensions against the target PCB layout to guarantee mechanical fitment. Confirm that the thermal management requirements align with the component's derating curves for the intended operating environment.
Select this component when a 2 A continuous current rating and 400 V reverse voltage are required for AC-DC conversion. Consider the thermal resistance and mounting orientation if high ambient temperatures are expected. Verify that the surge current capacity meets the inrush requirements of the load circuit. Compare the forward voltage drop against efficiency targets for the specific application design.
This part belongs to the KBU series of bridge rectifiers from Comchip Technology. The series offers various voltage ratings and current capacities to suit different power supply designs. The KBU2504-G specifically addresses applications requiring moderate current handling with standard voltage isolation levels.
Compatible substitutes include the KBU2504 from other manufacturers offering identical electrical parameters and pin configurations. Verify that alternative components maintain the same KBPC package outline and thermal performance characteristics.