SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MDD KMB16F is a surface-mount Schottky bridge rectifier in the MBF series, designed for low-profile applications. It features a maximum repetitive peak reverse voltage of 60V and an average forward rectified current of 1.0A at 30°C case temperature. The device exhibits a typical instantaneous forward voltage of 0.70V at 1A and a maximum reverse leakage current of 10µA at 100°C. It supports a peak forward surge current of 30A and operates within a junction temperature range of -55°C to +125°C. The component utilizes a molded plastic body with solder-plated terminals and is supplied in tape and reel packaging.
Verify that the ordered part matches the original MDD KMB16F designation and the associated specification sheet N0626-MBFKMB16FS1006. Confirm compliance with RoHS and RoHS III standards as documented in the datasheet. Ensure the package type corresponds to the MBF SMD configuration with appropriate polarity marking. Check that the supplier provides valid traceability documentation for the batch.
Select this component when a 60V reverse voltage rating and 1.0A continuous current capacity are required in a surface-mount format. Consider the 0.70V forward voltage drop for efficiency calculations at rated load. Evaluate thermal resistance of 100°C/W for heat dissipation planning on copper pads. Verify that the operating environment stays within the specified -55°C to +125°C junction temperature range.
The KMB16F belongs to the MBF series of SMD Schottky bridge rectifiers manufactured by MDD. This series includes variants with different voltage ratings such as KMB14F (40V), KMB18F (80V), and KMB110F (100V). All share the same MBF package footprint and general electrical architecture, differing primarily in their peak reverse voltage specifications.
Cross-reference parts must match the 60V reverse voltage, 1.0A current rating, and MBF package dimensions. Verify equivalent forward voltage and leakage current specifications to ensure circuit compatibility. Confirm that substitute components support the same reflow soldering profile and thermal management requirements.