L4006D8TP

Triacs Overview

The L4006D8TP is a sensing triac manufactured by Littelfuse, designed for AC power control applications. It features a 6 A RMS on-state current and a 400 V rated repetitive off-state voltage. The device operates within a junction temperature range of -40 °C to +150 °C. Key electrical parameters include a maximum on-state voltage of 1.6 V, a gate trigger voltage of 2 V, and a gate trigger current ranging from 10 mA to 20 mA. It is housed in a TO-252 (D-PAK) surface-mount package.

Triacs Feature Summary

• Sensing gate structure for reliable triggering with low gate current requirements
• High thermal stability supporting operation up to 150 °C junction temperature
• Surface-mount D-PAK package optimized for automated PCB assembly

Triacs Applications

• Solid state relays
• AC motor speed controls
• Lighting dimmers

Triacs Procurement Notes

Verify the specific suffix 'D8' against the official Littelfuse datasheet to confirm the exact gate sensitivity class and packaging configuration. Ensure the ordering quantity aligns with the manufacturer's standard tube pack size to avoid partial reel issues during procurement.

Triacs Selection Notes

Select this component when a 400 V blocking voltage and 6 A continuous current are required in a compact surface-mount form factor. Compare the 10-20 mA gate trigger current specifications against the driving circuit capabilities to ensure sufficient margin for reliable switching under varying temperature conditions.

Triacs Part Context

This part belongs to the Lxx06xx series of sensing triacs from Littelfuse. It shares the 6 A current rating with other variants but differs in voltage ratings and gate characteristics. The D8 suffix typically denotes specific gate sensitivity and packaging details within this product family.

Triacs Replacement Considerations

Direct substitutes may include the L4006D8RP or other L4006 variants from Littelfuse. Verify that the replacement maintains the same 400 V rating, 6 A current capacity, and compatible TO-252 footprint before integration.