LE57D122BTC

Telecom Overview

The LE57D122BTC is a dual-channel Subscriber Line Interface Circuit (SLIC) from the Le5712 family, manufactured by Microchip Technology. It is housed in a 44-pin eTQFP package with a 12 x 12 mm footprint. The device supports loop start and ground start operations with battery voltages ranging from -39 V to -60 V. It provides reverse polarity transmission and includes on-chip thermal management to reduce power dissipation. Key electrical characteristics include a standby power consumption of 24 mW per channel and the ability to supply over 20 mA into a 2000 Ω load from a -48 V source.

Telecom Feature Summary

• Integrates two fully featured SLIC channels into a single compact package for high-density line card designs.
• Supports multiple control states including Active, Standby, Tip Open, and Disconnect with programmable thresholds.
• Includes per-channel fault detection, thermal shutdown protection, and an on-chip thermal management feature.
• Compatible with 3.3-V logic control inputs and offers optional dual battery operation for reduced power consumption.

Telecom Applications

• Low-cost, high-performance telephone line card applications for Central Offices (CO).
• Digital Loop Carrier (DLC) systems requiring small-footprint interface solutions.
• POTS applications meeting regional requirements such as TR-57-CORE in North America or standards in India, China, and Korea.

Telecom Procurement Notes

Verify component authenticity through authorized Microchip distributors or certified suppliers. Confirm the specific ordering suffix matches the required packing format, noting that a 'T' suffix indicates tape and reel delivery. Ensure the procurement documentation aligns with the RoHS-compliant green package specifications defined in the official datasheet.

Telecom Selection Notes

Select this component when designing high-density POTS line cards requiring integrated dual-channel functionality. Consider the 44-pin eTQFP package for space-constrained layouts. Evaluate the thermal management requirements based on the external resistor configuration needed to off-load power during active states. Ensure compatibility with the intended codec devices, such as Zarlink SLAC series components, for complete line circuit implementation.

Telecom Part Context

The LE57D122BTC belongs to the Le5712 Dual SLIC family, designed to replace discrete line interface solutions. It serves as a direct footprint-compatible alternative to the Zarlink Le5711, offering similar functionality with specific attenuation characteristics. This part is part of Microchip's portfolio for telecommunications infrastructure, focusing on reducing board space and component count for global POTS markets.

Telecom Replacement Considerations

The LE57D122BTC is footprint compatible with the Zarlink Le5711 Dual SLIC. Designers should verify signal integrity and thermal performance when substituting, as minor differences in internal architecture may exist. Ensure that the replacement maintains the required -63 dB reverse polarity specification if applicable to the original design constraints.