LTC6655CHLS8-2.5

Overview

The LTC6655CHLS8-2.5 is a precision bandgap voltage reference in an 8-lead hermetic ceramic LS8 package, offering a fixed 2.5V output with ±0.05% initial accuracy and a maximum temperature coefficient of 5ppm/°C. It operates within a supply range of 3V to 13.2V, drawing a typical quiescent current of 7.5mA. The device provides ±5mA sourcing and sinking capability with low dropout characteristics. Key performance metrics include 0.25ppm peak-to-peak noise (0.1Hz to 10Hz) and long-term drift of 20ppm/√kHr. It functions reliably across the –40°C to 125°C temperature range.

Feature Summary

• Hermetic 5mm × 5mm LS8 package eliminates humidity sensitivity for superior stability
• Advanced curvature compensation ensures predictable temperature characteristics
• Bidirectional load regulation supports both sourcing and sinking currents
• Low power shutdown mode reduces consumption below 20µA

Applications

• High resolution data acquisition systems
• Precision battery monitors
• Medical equipment
• Instrumentation and test equipment

Procurement Notes

Verify the specific CHLS8 suffix indicates the Ceramic LCC package variant rather than the standard MSOP plastic package. Confirm the 'C' grade designation aligns with the required ±0.05% accuracy and 5ppm/°C temperature coefficient specifications. Ensure the order information matches the hermetic packaging requirements for your environmental conditions.

Selection Notes

Select this component when high stability against humidity is critical, as the hermetic LS8 package prevents moisture absorption errors common in plastic packages. Choose the 'C' grade if the design tolerates ±0.05% initial accuracy instead of the tighter ±0.025% offered by the 'B' grade. Ensure the application requires the specific 2.5V output level and can accommodate the 3V minimum supply voltage constraint.

Part Context

This part belongs to the LTC6655 family of low noise, low drift precision references from Analog Devices. The LS8 package variant distinguishes itself from the more common MSOP plastic package by providing hermetic sealing, which significantly improves long-term stability and eliminates humidity-induced mechanical stress on the die.

Replacement Considerations

LTC6655BHLS8-2.5#PBF offers identical functionality with tighter ±0.025% accuracy and 2ppm/°C drift.