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LX5586HLL is listed in the RF Front End (LNA + PA) range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is WIRELESS LAN FRONT-END MODULE. Review the specifications below when checking this part for your BOM.
The LX5586HLL-TR is an RF front-end module designed for 5.15GHz to 5.85GHz frequency bands, supporting 802.11n/ac wireless standards. It features a Single-Pole Double-Throw (SPDT) switch configuration within a compact 16-XFQFN package measuring 2.5mm x 2.5mm. The device operates on a 5V supply and is rated for industrial temperature ranges from -40°C to +85°C. Packaged in tape and reel format with 4500 units per reel, it integrates low-noise amplifier and power amplifier functions for efficient signal transmission and reception.
Verify that the ordering suffix matches TR for tape-and-reel packaging. Confirm the manufacturer is Microchip Technology, as Atmel was previously associated with this product line. Ensure the package type is identified as 16-XFQFN or X1QFN with the specified 2.5x2.5mm dimensions. Check for RoHS compliance status if required by specific project regulations.
Select this component when designing systems requiring integrated LNA and PA capabilities for 5GHz Wi-Fi applications. The SPDT architecture simplifies board design by reducing external switch requirements. Consider the 5V operating voltage and industrial temperature range (-40°C to +85°C) for environmental suitability. The small form factor is ideal for modern compact wireless devices where board space is limited.
This RF front-end module belongs to Microchip's portfolio of wireless communication solutions. Originally developed under Atmel before its acquisition by Microchip, the LX5586 series targets high-performance Wi-Fi infrastructure. It complements other RF components by providing integrated amplification and switching, streamlining the design process for 802.11n/ac compliant devices.
Publicly confirmed substitute part numbers are not available in the provided documentation. Verify compatibility with existing circuit designs before considering alternative components from other manufacturers.
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