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M1F80M12W2-1LA is listed in the FET, MOSFET Arrays range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is AUTOMOTIVE-GRADE ACEPACK DMT-32. Review the specifications below when checking this part for your BOM.
FET, MOSFET Arrays specifications for M1F80M12W2-1LA
- Description：AUTOMOTIVE-GRADE ACEPACK DMT-32
- Series：ECOPACK®
- Mfr：STMicroelectronics
- Package：Tube
- Technology：Silicon Carbide (SiC)
- Configuration：4 N-Channel
- FET Feature：-
- Drain to Source Voltage (Vdss)：1200V (1.2kV)
- Current - Continuous Drain (Id) @ 25°C：30A (Tc)
- Rds On (Max) @ Id, Vgs：108mOhm @ 20A, 18V
- Vgs(th) (Max) @ Id：5V @ 1mA
- Gate Charge (Qg) (Max) @ Vgs：63nC @ 18V
- Input Capacitance (Ciss) (Max) @ Vds：1230pF @ 800V
- Power - Max：-
- Operating Temperature：-40°C ~ 175°C (TJ)
- Mounting Type：Through Hole
- Package / Case：32-PowerDIP Module (1.264", 32.10mm)
- Supplier Device Package：ACEPACK DMT-32
- Grade：-
- Qualification：-
FET, MOSFET Arrays datasheet and documents for M1F80M12W2-1LA
FET, MOSFET Arrays Overview
The M1F80M12W2-1LA is an automotive-grade SiC MOSFET power module from STMicroelectronics, housed in the ACEPACK DMT-32 package. It features a four-pack topology with a 1200 V blocking voltage and a typical on-resistance of 78 mΩ. The device supports press-fit installation and includes an integrated NTC thermistor for thermal monitoring. It operates within a junction temperature range up to 175 °C and meets AQG 324 qualification standards.
FET, MOSFET Arrays Feature Summary
- Automotive-grade silicon carbide technology ensuring high reliability
- Four-pack topology optimized for DC/DC converter stages
- Integrated NTC sensor for precise thermal management
FET, MOSFET Arrays Applications
- On-board charger (OBC) DC/DC converter stages
- Automotive traction inverters
- High-efficiency industrial power supplies
FET, MOSFET Arrays Procurement Notes
Verify component authenticity through authorized channels due to obsolete status. Confirm package integrity and pin alignment prior to assembly. Ensure handling procedures comply with ESD sensitivity requirements. Cross-reference datasheet revisions for updated electrical characteristics before final design approval.
FET, MOSFET Arrays Selection Notes
Select this module for applications requiring high switching frequencies and low conduction losses. Evaluate thermal resistance parameters against system cooling capabilities. Consider the four-pack configuration for phase-leg implementations. Verify gate drive voltage compatibility with specified limits.
FET, MOSFET Arrays Part Context
This component belongs to STMicroelectronics' ACEPACK DMT series, designed for compact, high-power density automotive applications. The DMT-32 package utilizes a Cu-AlN-Cu Direct Bonded Copper substrate for superior thermal performance compared to traditional ceramic alternatives.
FET, MOSFET Arrays Replacement Considerations
Public confirmed substitute part numbers are not available for this obsolete model. Engineers should consult official replacement guides or contact STMicroelectronics directly for end-of-life transition support.
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