M2S025T-1VF256

Soc System On Chip Overview

The M2S025T-1VF256 is a SmartFusion® 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 25K logic element FPGA fabric, featuring embedded flash technology for non-volatile configuration. The device operates within a core supply voltage range of 1.14 V to 1.26 V and supports industrial junction temperatures from -40 °C to 100 °C. It utilizes a 256-pin VF256 package with a 14x14 mm footprint.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with 25K FPGA logic elements
• Industrial temperature grade (-40 °C to 100 °C)
• Core supply voltage (VDD) range: 1.14 V to 1.26 V
• 256-pin VF256 package (14x14 mm)

Soc System On Chip Applications

• Embedded control systems requiring mixed-signal processing
• Secure IoT gateways utilizing integrated flash security
• Industrial automation controllers with real-time MCU requirements

Soc System On Chip Procurement Notes

Verify the specific suffix 'T' indicates the industrial temperature grade and '1' denotes the speed grade. Confirm the 'VF256' package designation matches the required 256-pin low-profile fine-pitch ball grid array. Ensure the design accounts for the 1.2 V nominal core voltage and appropriate I/O bank voltages as specified in the electrical characteristics.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA architecture is necessary within a 25K logic density constraint. The industrial temperature rating (-40 °C to 100 °C) is critical for harsh environments. Verify that the 256-pin package provides sufficient I/O count for the application interface requirements.

Soc System On Chip Part Context

This part belongs to the SmartFusion® 2 family, which combines low-power flash-based FPGAs with hard ARM Cortex-M3 cores. It is distinct from the IGLOO 2 family, which lacks the integrated MCU subsystem but shares similar FPGA fabric and flash technology characteristics.

Soc System On Chip Replacement Considerations

Direct replacements within the same package and pinout include other densities in the SmartFusion 2 series, such as the M2S010 or M2S050 variants, provided the logic density and I/O requirements are met. Cross-family migration to IGLOO 2 requires software adaptation due to the absence of the MSS.