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M2S050T-FCSG325 is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is IC SOC CORTEX-M3 166MHZ 325BGA. Review the specifications below when checking this part for your BOM.
The M2S050T-FCSG325 is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 56,340-logic element FPGA fabric. The device operates within a junction temperature range of -40°C to 100°C and utilizes a 325-pin Fine-pitch Ball Grid Array (FCBGA) package measuring 11x11 mm. Key electrical specifications include a core supply voltage (VDD) of 1.2V nominal and embedded non-volatile memory for configuration.
Verify the specific speed grade suffix corresponding to the required timing performance. Confirm that the ordering suffix matches the intended commercial or industrial temperature rating. Ensure the package type aligns with PCB layout constraints for the 325-ball FCBGA form factor.
Select this model when both MCU processing and FPGA flexibility are required in a single component. Consider the thermal resistance characteristics for heat dissipation in enclosed environments. Evaluate power consumption requirements against the available VDD and I/O supply voltages.
This component belongs to the SmartFusion 2 family, which combines flash-based FPGA fabric with a hardened microcontroller subsystem. It is designed for applications demanding high security and reliability through its non-volatile architecture.
Direct replacements within the same density class include other variants of the M2S050 series with different package options or speed grades. Cross-family migration to IGLOO 2 requires removing the integrated MSS components.
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