M2S060-FCS325

Soc System On Chip Overview

The M2S060-FCS325 is a SmartFusion 2 System-on-Chip FPGA manufactured by Microchip Technology. It integrates an ARM Cortex-M3 microcontroller subsystem with a 56,340-logic element FPGA fabric in a 325-ball FCBGA package. The device operates at a maximum clock frequency of 166 MHz and includes 256 KB of program memory and 64 KB of data RAM. Key electrical specifications include a core supply voltage (VDD) of 1.2 V typical, with commercial operating junction temperatures ranging from 0 °C to 85 °C.

Soc System On Chip Feature Summary

• Integrates ARM Cortex-M3 processor with 56,340 Logic Elements
• Includes 256 KB Flash and 64 KB SRAM
• Supports DDR, PCIe, and SERDES peripherals
• Features Ethernet, USB, CANbus, I2C, SPI, UART, and USART connectivity

Soc System On Chip Applications

• Industrial automation controllers
• Automotive infotainment systems
• Medical imaging devices
• Telecommunications infrastructure

Soc System On Chip Procurement Notes

Verify the specific temperature grade suffix against project requirements, as the base model designation may imply commercial or industrial ranges depending on the full part number configuration. Confirm RoHS compliance status through official Microchip documentation prior to integration. Ensure ESD handling protocols are followed during assembly due to the sensitivity of the flash-based technology.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA solution is required to reduce board space and power consumption. Compare logic density against the M2S050 variant if resources are limited. Verify that the 325-ball FCBGA package fits the PCB footprint constraints. Check thermal resistance values for the specific airflow conditions of the target enclosure.

Soc System On Chip Part Context

This device belongs to the SmartFusion 2 family, which bridges the gap between traditional MCUs and FPGAs. It shares architectural similarities with the IGLOO 2 FPGA series but adds the hard-core ARM Cortex-M3 subsystem. The M2S060 designation indicates a mid-range logic density within the SmartFusion 2 portfolio, offering a balance between processing power and programmable I/O flexibility.

Soc System On Chip Replacement Considerations

The M2S060TS-1FGG484M offers higher pin count and different packaging. The M2S050-FCS325 provides lower logic density in the same package. Cross-referencing pinouts and thermal characteristics is essential when substituting these variants.