M2S090TS-1FCSG325

Soc System On Chip Overview

The M2S090TS-1FCSG325 is a SmartFusion® 2 System-on-Chip FPGA from Microchip Technology, featuring an ARM® Cortex®-M3 core and approximately 90K logic elements. It operates within a junction temperature range of 0°C to 85°C (Commercial) or -40°C to 100°C (Industrial). The device utilizes a 325-pin FCBGA package with dimensions of 11x13.5 mm. Key electrical parameters include a DC core supply voltage (VDD) of 1.14V to 1.26V and I/O supply voltages ranging from 1.14V to 3.3V depending on the bank configuration.

Soc System On Chip Feature Summary

• Integrates an ARM Cortex-M3 microcontroller subsystem with embedded flash and SRAM alongside a 90K logic element FPGA fabric.
• Supports high-speed communication via up to four PCI Express Gen 2 endpoints and integrated hard DDR3 memory controllers.
• Features low-power flash technology providing non-volatile configuration and data security with 20-year retention.
• Includes rich industry-standard peripherals such as Ethernet, USB, and CAN for direct system connectivity.

Soc System On Chip Applications

• Industrial automation and control systems requiring real-time processing and secure boot.
• Automotive infotainment and instrument clusters utilizing CANbus and Ethernet interfaces.
• Telecommunications infrastructure equipment leveraging PCIe and SerDes capabilities.
• Medical devices needing reliable, low-power embedded processing with hardware security features.

Soc System On Chip Procurement Notes

Verify the specific speed grade suffix (-1) and temperature grade against project requirements. Confirm the package type is 325-FCBGA (11x13.5mm). Ensure that the design accounts for the recommended operating conditions, particularly the VDD and VPP supply voltages specified in the datasheet. Check for RoHS compliance status if required by regional regulations.

Soc System On Chip Selection Notes

Select this component when a combined MCU and FPGA solution is needed to reduce board space and power consumption. Compare logic density and I/O count against alternative densities like M2S050T or M2S150TS. Consider thermal resistance values (θJA) for heat dissipation planning. Verify peripheral availability, such as the number of available SerDes lanes and DDR controllers, matches the interface requirements.

Soc System On Chip Part Context

This part belongs to the SmartFusion® 2 family, which bridges the gap between traditional MCUs and FPGAs. It shares the same underlying IGLOO® 2 flash FPGA technology but adds a hardened MSS. The 'TS' designation indicates it includes the MSS, while '090' denotes the approximate logic element count. The '-1' suffix specifies the speed grade for timing closure.

Soc System On Chip Replacement Considerations

Direct replacements within the same family include other SmartFusion 2 variants with different logic densities or package sizes, such as M2S090-1FCSG325 (without MSS) or M2S150TS-1FCSG325 (higher density). Cross-family migration to IGLOO 2 requires removing the MSS functionality. Always verify pin compatibility and thermal characteristics when substituting.