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M2S100TS-1FC1152I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists Microsemi Corporation. Its product description is IC SOC CORTEX-M3 166MHZ 1152BGA. Review the specifications below when checking this part for your BOM.
The M2S100TS-1FC1152I is a SmartFusion2 System-on-Chip FPGA manufactured by Microchip Technology, formerly Microsemi. It integrates an ARM Cortex-M3 processor with 146K logic elements and embedded memory within a 1152-pin FCBGA package. The device supports high-speed serial interfaces operating up to 12.7 Gbps and features non-volatile flash memory for instant-on capability. Operating voltage ranges from 0.97V to 1.08V, with an industrial temperature range of -40°C to 100°C.
Verify the manufacturer designation as Microchip Technology, resulting from the acquisition of Microsemi. Confirm the suffix 'I' indicates industrial temperature rating (-40°C to 100°C). Check for export control classifications (ECCN) as this product may require additional documentation for export from the United States. Ensure moisture sensitivity level (MSL 6) handling procedures are followed during assembly.
Select this model when both programmable logic and an embedded microcontroller are required on a single die. Compare against the M2GL series if low power is prioritized over processing performance, or against MPF500TS for higher logic density. Verify that the 1152-pin footprint matches the target PCB design constraints and that the 146K LE count suffices for the specific application complexity.
This component belongs to the SmartFusion2 family, which bridges the gap between traditional FPGAs and microcontrollers. It combines the flexibility of FPGA fabric with the deterministic processing of an ARM Cortex-M3 core. This architecture is distinct from the IGLOO2 (M2GL) and PolarFire (MPF) families, offering a unique mix of security, low power, and processing capabilities.
Direct pin-to-pin replacements within the same package are limited to other SmartFusion2 variants with compatible logic densities, such as the M2S150T series, provided the memory and I/O requirements align. Cross-family migration to IGLOO2 or PolarFire requires significant design rework due to architectural differences.
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