M2S150TS-FC1152I

Soc System On Chip Overview

The M2S150TS-FC1152I is a SmartFusion 2 System-on-Chip FPGA from Microchip Technology, featuring 146K logic elements and an integrated ARM Cortex-M3 microcontroller subsystem. It utilizes low-power flash technology for non-volatile configuration in a 1152-pin FCBGA package. The device supports industrial operating temperatures ranging from -40°C to +100°C. Key electrical specifications include a core supply voltage (VDD) of 1.2V nominal and embedded memory capabilities. It integrates hard peripherals including Ethernet, USB, and CAN controllers within the MSS.

Soc System On Chip Feature Summary

• Integrates 146K Logic Elements with an ARM Cortex-M3 processor subsystem
• Industrial temperature grade (-40°C to +100°C) with 20-year data retention
• Supports high-speed SerDes interfaces and up to four PCIe Gen 2 endpoints
• Includes embedded hard DDR3 memory controllers with error correction

Soc System On Chip Applications

• Secure industrial control systems requiring real-time processing
• Automotive infotainment and body control modules
• Telecommunications infrastructure equipment
• Medical imaging devices with secure boot requirements

Soc System On Chip Procurement Notes

Verify the specific suffix 'TS' confirms the industrial temperature range and security density. Confirm the FC1152 package type matches the target PCB footprint. Check for export control classifications as indicated in distributor listings. Ensure design tools support the SmartFusion 2 family architecture.

Soc System On Chip Selection Notes

Select this model when both FPGA fabric flexibility and MCU integration are required. Compare against IGLOO 2 variants if no processor core is needed. Verify that the 146K LE count meets logic resource requirements. Ensure power supply designs accommodate the 1.2V core and multiple I/O bank voltages specified in the datasheet.

Soc System On Chip Part Context

This component belongs to the SmartFusion 2 family, which combines flash-based FPGA fabric with a hardened ARM Cortex-M3 subsystem. It differs from the IGLOO 2 series by including the microcontroller and associated peripherals like Ethernet and USB controllers on the same die.

Soc System On Chip Replacement Considerations

Direct pin-compatible replacements within the same package may include other densities in the SmartFusion 2 series such as M2S090 or M2S060 variants, subject to logic resource sufficiency. Cross-family migration to PolarFire requires significant architectural redesign.