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M74HC174TTR is listed in the Flip Flops range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is IC FF D-TYPE SNGL 6BIT 16TSSOP. Review the specifications below when checking this part for your BOM.
The M74HC174TTR is a hex D-type flip-flop manufactured by STMicroelectronics, featuring a single element with six bits of positive-edge triggered data storage. It includes an asynchronous clear function and operates within a supply voltage range of 2 V to 6 V. The device utilizes CMOS technology and is housed in a 16-TSSOP surface-mount package. It supports industrial temperature ranges from -55°C to +125°C and offers low static power consumption typical of the HC logic series.
Verify component authenticity through authorized distributors or direct manufacturer channels due to potential availability constraints. Confirm RoHS compliance status and specific tape-and-reel packaging requirements prior to ordering. Ensure handling procedures account for moisture sensitivity levels as indicated in the official datasheet to prevent package damage during assembly.
Select this component when a compact hex D-type flip-flop with asynchronous clear functionality is required. Consider the 16-TSSOP package for space-constrained printed circuit board designs. Evaluate the operating voltage range against system power rails to ensure compatibility. Assess thermal management needs based on the specified power dissipation limits under expected load conditions.
This part belongs to the M74HC174 family of digital logic integrated circuits produced by STMicroelectronics. It is categorized under flip-flops and memory elements within the broader logic IC portfolio. The TTR suffix typically denotes the specific tape-and-reel packaging configuration suitable for automated surface-mount assembly processes.
Consult official STMicroelectronics documentation for verified pin-compatible substitutes within the same logic family. Cross-reference specifications such as propagation delay, output drive current, and package dimensions before implementing any alternative components to maintain circuit integrity.
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