MA4FCP200

$2.69

Description：RF DIODE PIN 100MW DIE
Series：-

SKU:f584636bd7b8 Category: RF Diodes Brand: MACOM Technology Solutions

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Product introduction

MA4FCP200 is listed in the RF Diode range at ChipApex. The manufacturer field lists MACOM Technology Solutions. Its product description is RF DIODE PIN 100MW DIE. Review the specifications below when checking this part for your BOM.

RF Diode specifications for MA4FCP200

Description：RF DIODE PIN 100MW DIE
Series：-
Mfr：MACOM Technology Solutions
Package：Tray
Diode Type：PIN - Single
Voltage - Peak Reverse (Max)：-
Current - Max：100 mA
Capacitance @ Vr, F：0.03pF @ 40V, 1MHz
Resistance @ If, F：3Ohm @ 50mA, 100MHz
Power Dissipation (Max)：100 mW
Operating Temperature：-55°C ~ 125°C (TJ)
Package / Case：Die
Supplier Device Package：Die
Grade：-
Qualification：-

RF Diode datasheet and documents for MA4FCP200

MA4FCP200

RF Diode Overview

The MA4FCP200 is a silicon flip chip PIN diode utilizing MACOM's HMIC process for repeatable electrical characteristics. It features extremely low parasitics, silicon nitride passivation to minimize leakage current, and a polymer layer for scratch protection. The device operates within a temperature range of -55°C to +125°C with a maximum reverse voltage of 70V. Key electrical parameters include a typical total capacitance of 0.02pF at 1GHz, series resistance of 2.8 Ohms at 1GHz, forward voltage of 1.25V at 100mA, and a carrier lifetime of 100ns.

RF Diode Feature Summary

Low series resistance and capacitance for high-frequency performance
Fast switching speed suitable for rapid signal control
Silicon nitride passivation minimizes leakage current
Polymer scratch protection prevents active area damage

RF Diode Applications

Multi-throw switches requiring fast switching speeds
Switched phase shifter circuits operating up to 18GHz
RF circuitry demanding low parasitic components

RF Diode Procurement Notes

Verify the specific ordering suffix against official documentation before purchase. Standard packaging is available as die in gel pack, while wafer cut on tape requires a distinct part number. Ensure static-free handling procedures are followed during receipt due to ESD sensitivity ratings.

RF Diode Selection Notes

Select this component for applications requiring sub-20ns switching speeds at frequencies up to 18GHz. Consider the ODS-186 package thermal resistance when designing heat dissipation. Verify substrate compatibility for conductive epoxy or eutectic solder mounting methods.

RF Diode Part Context

This device belongs to the SMPP series of PIN diodes manufactured by MACOM Technology Solutions. It is designed for RF and microwave applications where low parasitics and fast switching are critical. The flip chip architecture allows for direct mounting onto hard or soft substrates.