MADP-017015-13140G

RF Diode Overview

The MADP-017015-13140G is a silicon, glass PIN diode surmount chip from MACOM Technology Solutions. It utilizes the HMIC process with a 15 µm I-region length and features an ODS-1314 package outline. Key electrical specifications include a maximum reverse voltage of 115 V, typical capacitance (CT) of 0.32 pF at -40 V/1 GHz, and series resistance (RS) of 0.72 Ω at +10 mA/1 GHz. The device supports a forward current of up to 500 mA, operates within a temperature range of -55 °C to +125 °C, and handles CW incident power up to 50 dBm.

RF Diode Feature Summary

• Utilizes MACOM patented HMIC process with embedded silicon pedestals in low-loss glass for exceptional heat transfer.
• Features vertical topology with selective backside metallization and conductive pedestal sidewalls for surface mount capability.
• Encapsulated with silicon nitride and polymer layers to protect the junction and anode air-bridge during handling.
• Designed without wirebonds to achieve low parasitic inductance and excellent RC constants.

RF Diode Applications

• Higher frequency switch elements requiring low parasitic inductance.
• Moderate incident power applications up to 50 dBm C.W.
• Peak power applications up to 75 dBm with pulse widths ≤1 µs and duty cycles ≤0.01%.

RF Diode Procurement Notes

Verify the specific ordering suffix when purchasing. The 'G' suffix indicates a 100-piece gel pack, while the 'P' suffix denotes a 3000-piece reel. Confirm RoHS compliance status as required by the project specifications. Ensure handling procedures are followed to prevent damage from abrasion or mechanical shock during bulk handling.

RF Diode Selection Notes

Select this component for designs requiring high average and peak power handling with minimal parasitic effects. The 15 µm I-region length offers a balance between capacitance and resistance suitable for moderate power levels. Consider the thermal resistance of 30 °C/W when designing heat dissipation paths on hard or soft substrates using recommended soldering techniques.

RF Diode Part Context

This part belongs to the MAPD-017015 & MAPD-030015 SURMOUNT™ 15 µm PIN Diode family. It shares identical physical dimensions and mounting pad locations with the MADP-030015 variant, differing primarily in internal electrical characteristics such as capacitance and resistance values.

RF Diode Replacement Considerations

The MADP-030015-13140G is a direct pin-compatible alternative within the same datasheet. It shares the same ODS-1314 outline and mounting requirements but exhibits higher capacitance and lower series resistance compared to the MADP-017015.

RF Diode FAQ

What is the recommended mounting method for this device?

Surface mount technology is recommended. Devices can be attached to hard or soft substrates using 80Au/20Sn or RoHS compliant solders. For average power around 1 W, conductive silver epoxy may also be used.

How is the series resistance defined for this component?

Series resistance (RS) is equivalent to the total diode resistance, calculated as the sum of Junction Resistance (Rj) and Ohmic Resistance (Rc).

What are the absolute maximum ratings for reverse voltage and forward current?

The absolute maximum reverse voltage is 115 V, and the absolute maximum forward current is 500 mA.