MADP-017015-13140P

RF Diode Overview

The MADP-017015-13140P is a silicon PIN diode from the SURMOUNT™ family, utilizing MACOM's HMIC process with a 15 µm intrinsic region. It features an ODS-1314 package outline equivalent to a 0603 footprint. Key electrical specifications include a maximum reverse voltage of 115 V and a forward current rating of 500 mA. At 1 GHz and -40 V bias, typical capacitance is 0.32 pF, while series resistance ranges from 0.51 Ω at +70 mA to 0.72 Ω at +10 mA. The device operates within a temperature range of -55°C to +125°C.

RF Diode Feature Summary

• Vertical topology with embedded silicon pedestals in low-loss glass for exceptional heat transfer
• Surface mount design requiring no wirebonds, featuring selective backside metallization
• Fully encapsulated topside protected by silicon nitride and polymer layers against mechanical damage
• Low parasitic inductance (0.4 nH) and excellent RC constant suitable for high-frequency switching

RF Diode Applications

• Moderate incident power RF switches operating up to 50 dBm CW
• High peak power applications handling up to 75 dBm pulse power
• Higher frequency switch elements where low parasitics are critical

RF Diode Procurement Notes

Verify the specific ordering suffix to confirm packaging configuration. The 'P' suffix indicates a reel containing 3000 pieces, whereas the 'G' suffix denotes a gel pack containing 100 pieces. Confirm that the required quantity aligns with the selected packaging format before finalizing procurement orders.

RF Diode Selection Notes

Select this component when a surface-mount PIN diode with low parasitic inductance is required for frequencies extending into the gigahertz range. The 15 µm I-region length provides a balance between capacitance and resistance. Ensure the application environment remains within the specified -55°C to +125°C operating temperature limits.

RF Diode Part Context

This part belongs to the MAPD-017015 & MAPD-030015 product family, which shares identical physical dimensions but differs in electrical characteristics due to varying intrinsic region lengths. The MADP-017015 specifically utilizes a 15 µm I-region, distinguishing it from other variants in the same package style.

RF Diode Replacement Considerations

Direct replacements must match the ODS-1314 outline and electrical parameters. Verify compatibility with existing PCB mounting pads and soldering profiles, as these devices require specific thermal management during attachment to hard or soft substrates.

RF Diode FAQ

What is the recommended soldering method for this device?

Hot gas die bonding is preferred for hard substrates, while soft solder is recommended for soft substrates like Duroid. A vacuum tip pick-up tool and downward force of 60 to 100 grams are recommended during attachment.

How is the series resistance defined in the datasheet?

Series resistance (RS) is equivalent to the total diode resistance, calculated as the sum of Junction Resistance (Rj) and Ohmic Resistance (Rc).

What protective coatings are applied to the device?

The topside is fully encapsulated with silicon nitride and includes an additional polymer layer to provide scratch and impact protection for the junction and anode air-bridge.