MADP-017025-13140P

RF Diode Overview

The MADP-017025-13140P is a PIN diode from MACOM Technology Solutions, utilizing Silicon Heterostructure Microwave Integrated Circuit (HMIC) technology. It is housed in a surface-mount Surmount package designed for high-frequency RF applications. The component operates as a variable reactance or resistance element, suitable for switching and attenuation functions in microwave circuits. Key electrical characteristics include a low forward resistance and high reverse breakdown voltage, enabling efficient signal control at GHz frequencies.

RF Diode Feature Summary

• Utilizes HMIC technology for enhanced performance in microwave integrated circuits
• Surface-mount Surmount package design facilitates automated assembly and compact layout
• Optimized for high-frequency RF switching and attenuation applications

RF Diode Applications

• RF switching networks
• Variable attenuators
• Phase shifters

RF Diode Procurement Notes

Verify the specific ordering suffix to ensure the correct tape and reel configuration matches your manufacturing requirements. Confirm RoHS compliance status through the latest manufacturer documentation before integration. Check for any product change notifications that may affect pin compatibility or material composition. Ensure the supplier provides valid traceability documents for quality assurance purposes.

RF Diode Selection Notes

Select this component when a low-loss, high-isolation PIN diode is required for surface-mount designs. Evaluate the thermal management capabilities of the PCB layout to handle power dissipation during continuous operation. Compare the junction capacitance and series resistance against circuit simulation models to verify performance at the target frequency band.

RF Diode Part Context

This part belongs to MACOM's HMIC family of PIN diodes, which are engineered for robust performance in demanding RF environments. The Surmount package variant offers improved reliability compared to traditional leaded packages, supporting modern high-volume production techniques while maintaining consistent electrical characteristics across the batch.

RF Diode Replacement Considerations

Direct substitutes must match the HMIC technology node and Surmount package footprint. Verify that alternative PIN diodes offer comparable forward resistance and reverse breakdown voltage ratings. Ensure the replacement device supports the same operating frequency range and power handling capabilities without requiring PCB redesign.