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MAX13432EETD+T is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSCEIVER FULL 1/1 14TDFN. Review the specifications below when checking this part for your BOM.
The MAX13432EETD+T is a full-duplex RS-485 transceiver featuring an adjustable low-voltage logic interface for multivoltage systems. It operates with a VCC supply from +3V to +5.5V and supports VL from +1.62V to VCC. The device includes one driver and one receiver, supporting data rates up to 500kbps with slew-rate limiting. It provides ±30kV ESD protection on I/O pins and features hot-swap capability. The component is housed in a 14-pin TDFN package with an exposed pad.
Verify the specific ordering suffix against official Analog Devices documentation to confirm package type and tape-and-reel specifications. Ensure the component meets RoHS compliance requirements for your assembly process. Cross-reference the manufacturer part number with authorized distributor catalogs to validate authenticity and traceability before procurement.
Select this component for full-duplex RS-485 networks requiring compatibility with low-voltage logic levels down to 1.62V. It is suitable for systems needing high node density due to its 1/8-unit load receiver impedance. Choose this variant over half-duplex models when simultaneous bidirectional communication is required. Verify that the 500kbps data rate aligns with system timing constraints.
This device belongs to the MAX13430E–MAX13433E family of RS-485 transceivers manufactured by Analog Devices (Maxim Integrated). The series distinguishes between half-duplex and full-duplex variants, as well as limited and unlimited slew-rate drivers. The MAX13432E specifically denotes the full-duplex version with reduced slew-rate characteristics for lower EMI.
Direct functional substitutes within the same family include the MAX13432EESD+ (SOIC package) and MAX13432EETB+ (different TDFN footprint). Verify pinout compatibility and thermal resistance differences when substituting packages.
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