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MAX203ECPP is listed in the Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSCEIVER FULL 2/2 20PDIP. Review the specifications below when checking this part for your BOM.
The MAX203ECPP is a full-duplex RS-232 transceiver manufactured by Analog Devices Inc./Maxim Integrated. It features two drivers and two receivers within a 20-pin Plastic DIP package. The device operates on a single +5V supply, utilizing integrated internal charge-pump capacitors to generate the required ±10V levels without external components. It supports data rates up to 120kbps and includes high ±15kV ESD protection on all RS-232 inputs and outputs. The component is rated for an operating temperature range of 0°C to +70°C.
Verify the specific suffix 'CPP' against official manufacturer documentation to confirm the 20-pin Plastic DIP package configuration. Confirm that the 'E' designation aligns with the required ±15kV ESD protection specifications. Ensure the commercial temperature range (0°C to +70°C) meets the operational environmental requirements of the target system before procurement.
Select this component when a full-duplex RS-232 interface is required in a space-constrained design. The integrated capacitors reduce board space compared to devices requiring external charge-pump components. Verify that the 120kbps maximum data rate satisfies the application's throughput needs and that the 20-pin DIP package fits the available footprint constraints.
The MAX203ECPP belongs to the MAX202E–MAX213E family of RS-232 transceivers. This family shares common architecture features such as single-supply operation and ESD protection. The MAX203 variant specifically distinguishes itself by integrating the charge-pump capacitors internally, simplifying the external circuit design compared to variants like the MAX202E which require four external capacitors.
Publicly confirmed substitutes include the MAX203EEWP and MAX203CWP. These alternatives share the same functional core but differ in package type (SOIC vs. DIP) or compliance status. Verify pin compatibility and thermal characteristics when substituting.
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