MAX2324EUP-T

$3.56

Description：IC DOWN CONVERTER 20-TSSOP
Series：-
Mfr：Analog Devices Inc./Maxim Integrated
Package：Bulk

SKU:d96d79218463 Category: RF Misc ICs and Modules Brand: Analog Devices Inc./Maxim Integrated

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Product introduction

Product Detailed Parameters

Description：IC DOWN CONVERTER 20-TSSOP
Series：-
Mfr：Analog Devices Inc./Maxim Integrated
Package：Bulk
Function：-
Frequency：-
RF Type：-
Secondary Attributes：-
Mounting Type：-
Package / Case：-
Supplier Device Package：-
Grade：-
Qualification：-

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MAX2324EUP-T

Overview

The MAX2324EUP-T is a dual-band Low Noise Amplifier and Mixer integrated circuit manufactured by Analog Devices Inc. utilizing SiGe technology. Designed for PCS band applications, it operates within the frequency range of 1.85 GHz to 1.91 GHz. The component is housed in a 20-TSSOP package with an exposed pad, suitable for surface mount installation. This device integrates both amplification and mixing functions into a single compact solution.

Feature Summary

Integrates dual-band LNA and mixer functionality
Utilizes Silicon Germanium (SiGe) technology
Optimized for PCS band frequency operations

Applications

PCS band wireless communication systems
Dual-band RF front-end modules
Mobile phone receiver circuits

Procurement Notes

Verify part authenticity through authorized channels as this component may be obsolete or subject to limited supply conditions. Confirm that the specific suffix matches the required tape and reel packaging format. Ensure compatibility with existing PCB layouts regarding the 20-TSSOP-EP footprint and thermal requirements before finalizing procurement orders.

Selection Notes

Select this component when a combined LNA and mixer solution is required for PCS band frequencies. Consider the SiGe process benefits for linearity and noise performance. Evaluate the 20-TSSOP package constraints against available board space and thermal dissipation capabilities compared to alternative discrete solutions.

Part Context

This part belongs to the MAX232 series of RF components designed for mobile communication applications. It serves as a specialized integrated circuit addressing the need for compact, high-performance signal conditioning in dual-band architectures commonly found in cellular handsets and related wireless infrastructure equipment.

Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation. Consult manufacturer resources for potential obsolescence management or cross-reference options if this specific variant is no longer supported.

How to buy

Online and offline orders are supported. If the item is available for online purchase, you can place it in the cart; for wholesale pricing, please contact our product manager for a quote.

Payment Method

Payment methods: T/T, WeChat Pay, credit cards, Google Pay, Apple Pay . Buyer covers shipping, fees, duties, and taxes; contact our product manager if you need a contract/procurement process.

Delivery time

In-stock items usually ship within 24 hours. Otherwise, shipment is arranged 1 to 2 days after the items arrive at our warehouse. Timing depends on destination and shipping method.

Freight calculation

Freight cost depends on destination, package size, and weight . We offer shipping options via DHL, FedEx, UPS, and TNT , and can ship using your freight account upon request.

Mode of Transportation

We ship via DHL, FedEx, UPS, and TNT. If you prefer a specific logistics provider, we can ship using your designated carrier.

Return and Refund

Returns are accepted within 60 days of invoice with RMA approval. Items must be resalable; original invoice and test report are required. No returns for customer errors.