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MAX3394EETA+T is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC TRANSLTR BIDIRECTIONAL 8TDFN. Review the specifications below when checking this part for your BOM.
The MAX3394EETA+T is a dual bidirectional voltage level translator in an 8-pin TDFN package. It operates with VCC supply voltages from +1.65V to +5.5V and VL supply voltages from +1.2V to VCC. The device supports a guaranteed data rate of 6Mbps with push-pull drivers and 1Mbps with open-drain drivers. It features internal slew-rate enhancement circuitry providing 10mA current-sink and 15mA current-source capabilities. The component includes thermal-shutdown protection, tri-state output mode, and ±15kV Human Body Model ESD protection on the VCC side.
Verify the specific ordering suffix matches the required package type and RoHS compliance status. Confirm that the exposed paddle connection requirements align with the PCB layout design. Ensure power-supply decoupling capacitors are placed as close to the device as possible to maintain signal integrity and ESD performance specifications.
Select this component when interfacing multivoltage systems requiring bidirectional data transfer without explicit direction control. The internal pullup resistors and slew-rate enhancement make it suitable for open-drain configurations with significant bus capacitance. Verify that the operating temperature range meets the environmental requirements of the target application.
This part belongs to the MAX3394E/MAX3395E/MAX3396E family of bidirectional level translators. While the MAX3395E offers four channels and the MAX3396E provides eight, the MAX3394E specifically integrates two independent translation channels. All variants share identical electrical characteristics, protection features, and operational principles within their respective channel counts.
Direct functional substitutes within the same family include the MAX3394EEBL+T, which utilizes a 9-bump UCSP package instead of the TDFN form factor.
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