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MAX469EWE is listed in the Video Amps And Modules range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is TWO-CHANNEL TRIPLE VIDEO BUFFER. Review the specifications below when checking this part for your BOM.
The MAX469EWE is a dual-channel, triple/quad RGB video switch IC manufactured by Analog Devices Inc./Maxim Integrated. It operates within a supply voltage range of 4.5V to 36V for single supply or ±4.5V to ±20V for dual supply configurations. The device features a maximum on-resistance of 1.25 Ohms and supports a continuous DC current of 200 mA per channel. Switching times are specified with a maximum turn-on time of 160 ns and a maximum turn-off time of 210 ns. It is housed in a 16-SOIC package and functions as an SPST analog switch suitable for video signal routing applications.
Verify the specific suffix 'EWE' against the official Maxim Integrated datasheet to confirm pinout compatibility and package dimensions. Ensure the operating temperature range meets system requirements. Confirm RoHS compliance status if environmental regulations apply to the final assembly. Cross-reference the manufacturer part number with authorized distributors to avoid counterfeit components.
Select this component when dual-channel video switching with low distortion is required. Compare the 1.25 Ohm on-resistance against other series members like the MAX4600 or MAX4602 if lower resistance is needed. Verify that the 16-SOIC package fits the PCB layout constraints. Consider the 200 mA current capability for driving loads directly without additional buffering stages.
The MAX469EWE belongs to the MAX469 family of video switches designed for high-speed analog signal handling. It is distinct from the quad-channel MAX4602 and the single-channel variants in the same product line. The device is specifically optimized for video applications requiring fast switching speeds and low charge injection.
Direct substitutes include the MAX469CWE+T and MAX469EPE. Verify electrical parameters such as on-resistance and switching speed before substitution. Check package compatibility between SOIC and DIP formats if mechanical changes are permissible.
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