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The MAX6023EBT21+T is a precision, low-power, low-dropout voltage reference IC from the MAX6023 family. It provides a fixed output voltage of 2.048 V with an initial accuracy of ±0.2%. The device features a maximum temperature coefficient of 30 ppm/°C and operates within an input voltage range up to 12.6 V. It is housed in a compact UCSP-5 (5-bump WLCSP) package measuring 1x1.52 mm. The component supports surface-mount installation and functions reliably across a temperature range of -40°C to +85°C.
Verify the specific suffix designation (+T) to ensure compatibility with reel packaging requirements. Confirm that the UCSP-5 package dimensions align with your PCB footprint constraints. Check regional availability status as distribution channels may vary. Ensure that the operating temperature range meets your environmental specifications. Validate that the fixed 2.048 V output matches your system design requirements before procurement.
Select this component when a fixed 2.048 V reference is required with minimal board space. Consider the 30 ppm/°C temperature coefficient for applications needing moderate thermal stability. Evaluate the low quiescent current against battery life requirements in portable devices. Compare the UCSP-5 package size against available alternatives if tighter footprints are necessary. Ensure the input voltage headroom accommodates the low-dropout characteristics.
This part belongs to the MAX6023 series of micropower voltage references designed for precision applications. The series offers various output voltages and accuracy grades within a consistent small form factor. It serves as a key component in power management integrated circuits for analog signal processing. The Maxim Integrated brand ensures compatibility with established industrial design standards.
Direct substitutes within the MAX6023 family include variants with different output voltages such as the MAX6023EBT30+T. Cross-reference other manufacturers' UCSP packages only if pin-out and electrical parameters match exactly. Verify that any replacement maintains the same 5-bump configuration and thermal characteristics.