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MAX6639FAEE+ is listed in the Thermal Management range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is IC 2CH TEMP MONITOR 16-QSOP. Review the specifications below when checking this part for your BOM.
Thermal Management specifications for MAX6639FAEE+
- Description：IC 2CH TEMP MONITOR 16-QSOP
- Series：-
- Mfr：Analog Devices Inc./Maxim Integrated
- Package：Tube
- Function：Fan Control, Temp Monitor
- Sensor Type：Internal and External
- Sensing Temperature：0°C ~ 150°C, External Sensor
- Accuracy：-2.5°C Local(Max), ±1°C Remote(Max)
- Topology：ADC, PWM Generator, Tach Counter
- Output Type：I2C/SMBus
- Output Alarm：Yes
- Output Fan：Yes
- Voltage - Supply：3V ~ 3.6V
- Operating Temperature：-40°C ~ 125°C
- Grade：-
- Qualification：-
- Mounting Type：Surface Mount
- Package / Case：16-SSOP (0.154", 3.90mm Width)
- Supplier Device Package：16-QSOP
Thermal Management datasheet and documents for MAX6639FAEE+
Thermal Management Overview
The MAX6639FAEE+ is a board-mount temperature sensor and hardware monitor in a 16-pin QSOP package. It operates from 3.0V to 3.6V with 500µA supply current. The device features an 11-bit resolution, ±1°C remote accuracy, and measures temperatures up to +150°C. It includes dual PWM outputs for fan control and supports SMBus interfaces.
Thermal Management Feature Summary
- Monitors local die temperature and two external diode-connected transistors
- Integrates dual PWM fan-speed controllers with tachometer feedback
- Provides three selectable SMBus addresses for multi-device systems
- Generates interrupt signals via ALERT, THERM, and OT open-drain outputs
Thermal Management Applications
- Desktop Computers
- Notebook Computers
- Servers
- Networking Equipment
Thermal Management Procurement Notes
Verify the specific suffix 'FAEE+' against the manufacturer's latest documentation to confirm lead-free compliance and exact operating range specifications. Ensure the ordering information matches the required pinout and thermal characteristics for the target application design.
Thermal Management Selection Notes
Select this component when system cooling requires precise monitoring of CPU or GPU junction temperatures alongside active fan management. The integrated automatic RPM mode simplifies thermal management by adjusting fan speed based on programmed temperature profiles without complex external logic.
Thermal Management Part Context
This part belongs to the MAX6639F series, which is optimized for n = 1.021 compatibility with Penryn processors. It serves as a comprehensive thermal management solution combining sensing and actuation in a single integrated circuit for high-density electronic assemblies.
Thermal Management Replacement Considerations
MAX6639ATE+
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