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MAX9728AETC+TWGA8 is listed in the Audio Amplifiers range at ChipApex. The manufacturer field lists Analog Devices Inc./Maxim Integrated. Its product description is INTEGRATED CIRCUIT. Review the specifications below when checking this part for your BOM.
The MAX9728AETC+TWGA8 is a stereo headphone amplifier utilizing DirectDrive architecture for single-supply operation. It delivers up to 60mW per channel into a 32Ω load with 0.02% THD+N. The device operates from a 4.5V to 5.5V supply, consuming 3.5mA quiescent current and less than 0.1µA in shutdown mode. It features an internally preset gain of -1.5V/V, 80dB PSRR at 1kHz, and integrated click-and-pop suppression. The component is housed in a 12-pin Thin QFN (3mm x 3mm) package.
Verify the specific suffix TWGA8 against official manufacturer documentation to confirm tape-and-reel packaging details and lot traceability requirements. Confirm that the part status remains active or qualified for new designs, as availability may vary. Ensure compliance with RoHS3 standards and check for any lead-time constraints associated with this specific marking code before finalizing procurement plans.
Select the MAX9728AETC+TWGA8 when board space is limited and external DC-blocking capacitors must be avoided. Choose this model over the adjustable-gain MAX9728A variant if a fixed -1.5V/V gain is sufficient for the application. Ensure the design supports a single 4.5V to 5.5V supply rail and requires low quiescent current consumption for portable devices.
This component belongs to the MAX9728 family of 60mW DirectDrive stereo headphone amplifiers manufactured by Analog Devices Inc./Maxim Integrated. The family includes variants with adjustable gain (MAX9728A) and fixed gain (MAX9728B). The ETTC package designation indicates a 12-pin Thin QFN form factor designed for surface-mount assembly in space-constrained portable electronics.
The MAX9728BEUD+ serves as a pin-compatible alternative within the same family, offering fixed gain but in a 14-pin TSSOP package. Verify package dimensions and thermal characteristics when substituting between QFN and TSSOP formats.
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