MBR200150CT

Diode Arrays Overview

The MBR200150CT is a silicon power Schottky diode module featuring a twin tower package configuration. It provides an average forward current of 200 A per package and supports repetitive peak reverse voltages ranging from 150 V to 200 V. The device operates within a junction temperature range of -55 °C to +150 °C, with a maximum thermal resistance of 0.45 °C/W per leg.

Diode Arrays Feature Summary

• High surge capability designed for robust transient handling
• Twin tower package construction for efficient mounting
• Not ESD sensitive for simplified handling

Diode Arrays Applications

• Low voltage high frequency inverters
• Free wheeling applications
• Polarity protection circuits

Diode Arrays Procurement Notes

Verify the specific voltage rating suffix (e.g., 150V vs 200V) as the series spans multiple options. Confirm terminal orientation requirements, noting that devices with an 'R' suffix feature reversed leads compared to standard configurations. Ensure compatibility with screw mount installation methods specified for this package type.

Diode Arrays Selection Notes

Select based on required blocking voltage within the 150 V to 200 V range and the 200 A continuous current capacity. Consider the 0.45 °C/W thermal resistance for heatsink design. Verify lead orientation needs, as the standard and 'R' variants have different pin configurations. Ensure the operating environment stays within the -55 °C to +150 °C junction temperature limits.

Diode Arrays Part Context

This component belongs to the MBR200150CT through MBR200200CTR series of silicon power Schottky diodes. Manufactured by GeneSiC Semiconductor, these modules utilize a twin tower package to deliver high current performance in a compact form factor suitable for demanding power conversion environments.

Diode Arrays Replacement Considerations

Cross-reference with other models in the MBR200 series for compatible current and voltage ratings. Verify mechanical footprint and terminal alignment, particularly if substituting with an 'R' variant which has reversed leads. Ensure thermal management solutions match the 0.45 °C/W junction-to-case resistance specification.