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MBR4050PT is listed in the Diode Arrays range at ChipApex. The manufacturer field lists onsemi. Its product description is DIODE ARR SCHOTT 50V 40A TO247AD. Review the specifications below when checking this part for your BOM.
The MBR4050PT is a silicon Schottky rectifier manufactured by onsemi, housed in a TO-247-3 through-hole package. It features a dual anode common cathode configuration with a maximum repetitive reverse voltage of 50 V and a forward current rating of 40 A. The device exhibits a typical forward voltage of 770 mV and supports a forward surge current of 330 A. Operating within a temperature range of -65 °C to +150 °C, it incorporates guard-ring technology for stress protection.
Verify the manufacturer designation carefully, as the MBR4050PT part number has been historically associated with Taiwan Semiconductor and General Electric. Confirm that the specific unit supplied is sourced from or qualified by onsemi to ensure compliance with their manufacturing standards and datasheet specifications. Cross-reference the ordering suffix and component marking against official onsemi documentation to avoid substitution errors.
Select this component for applications requiring high-efficiency rectification with low forward voltage drop. The TO-247 package provides robust thermal performance suitable for high-current environments. Ensure the circuit design accommodates the 50 V reverse voltage limit and utilizes the dual anode structure if common cathode topology is required for synchronous or bridge configurations.
This device belongs to the MBR40 series of Schottky barrier rectifiers, which are designed for general-purpose power conversion. The series offers various voltage ratings ranging from 35 V to 60 V while maintaining a consistent 40 A current capability. These components are engineered to replace traditional p-n junction rectifiers in applications where speed and efficiency are critical.
MBR4050CT
The maximum operating junction temperature is +150 °C.
Yes, the device includes a guard-ring structure at the periphery of the wafer to provide stress protection during operation.
It uses a TO-247-3 package with a Dual Anode Common Cathode configuration.
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