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MBRB30100CT-TP is listed in the Diode Arrays range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is DIODE ARRAY SCHOT 100V 30A D2PAK. Review the specifications below when checking this part for your BOM.
The MBRB30100CT-TP is a silicon Schottky rectifier manufactured by Micro Commercial Components. It features a dual anode common cathode configuration housed in a D2PAK-2 (TO-263-2) surface-mount package. The device supports a maximum repetitive reverse voltage of 100 V and an average forward current of 30 A. Key electrical characteristics include a forward voltage of 850 mV at rated current and a reverse leakage current of 10 uA.
Verify the specific suffix against official Micro Commercial Components documentation to confirm exact packaging and reel specifications. Ensure that the procurement channel provides valid traceability and authenticity guarantees for semiconductor components. Cross-reference the manufacturer part number with authorized distributor databases to confirm current availability status and compliance with relevant environmental directives such as RoHS.
Select this component when a surface-mount solution is required for high-current rectification tasks. The D2PAK-2 package offers superior thermal dissipation compared to smaller SMD packages. Consider the 100 V rating and 30 A continuous current capability to ensure adequate headroom for the target application's peak load requirements and operating temperature range.
This component belongs to the MBRB series of Schottky rectifiers from Micro Commercial Components. The series is characterized by its use of silicon technology and focus on high-efficiency power conversion. The MBRB30100CT-TP variant specifically addresses the need for compact, high-current surface-mount rectification in modern electronic designs.
Publicly confirmed substitute part numbers are not available in the provided source material. Verify compatibility with alternative manufacturers based on matching electrical parameters and physical footprint dimensions before implementation.
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