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MBRD1230CT-TP is listed in the Diode Arrays range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is DIODE ARRAY SCHOTT 30V 12A DPAK. Review the specifications below when checking this part for your BOM.
The MBRD1230CT-TP is a dual Schottky rectifier manufactured by Micro Commercial Components. It features a common cathode configuration housed in a DPAK-3 (TO-252-3) surface-mount package. The device utilizes silicon technology and supports an average forward current of 12 A with a repetitive reverse voltage rating of 30 V. Key electrical parameters include a maximum forward voltage of 470 mV, a peak forward surge current of 150 A, and a reverse leakage current of 500 uA. It operates within a junction temperature range of -65°C to +150°C.
Verify the specific datasheet version and RoHS compliance status directly with the manufacturer or authorized distributor before procurement. Confirm that the DPAK-3 package dimensions match your PCB footprint requirements. Ensure that the thermal management design accommodates the specified junction temperature limits under expected load conditions to maintain reliability.
Select this component when a low-voltage, high-current Schottky rectifier is required in a compact surface-mount form factor. The 30 V rating and 12 A current capacity define its operational envelope. Consider the 470 mV forward voltage drop for efficiency calculations. Verify that the 150 A surge current capability meets transient protection needs in the target circuit design.
This part belongs to the MBRD1230CT series of dual Schottky rectifiers from Micro Commercial Components. It is designed for general-purpose rectification in low-voltage DC power systems. The TO-252-3 package provides a balance between current handling capability and board space efficiency compared to larger through-hole alternatives.
Consult official substitution lists for electrically equivalent dual Schottky rectifiers in the DPAK-3 package with matching 30 V and 12 A ratings. Verify pinout compatibility and thermal performance specifications before replacing the original component.
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