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MBRF20035 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOT 35V 100A TO244AB. Review the specifications below when checking this part for your BOM.
Diode Arrays specifications for MBRF20035
- Description：DIODE MOD SCHOT 35V 100A TO244AB
- Series：-
- Mfr：GeneSiC Semiconductor
- Package：Bulk
- Diode Configuration：1 Pair Common Cathode
- Technology：Schottky
- Voltage - DC Reverse (Vr) (Max)：35 V
- Current - Average Rectified (Io) (per Diode)：100A
- Voltage - Forward (Vf) (Max) @ If：700 mV @ 100 A
- Speed：Fast Recovery =< 500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：1 mA @ 35 V
- Operating Temperature - Junction：-55°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：TO-244AB
- Supplier Device Package：TO-244AB
- Grade：-
- Qualification：-
Diode Arrays datasheet and documents for MBRF20035
Diode Arrays Overview
The MBRF20035 is a silicon Schottky diode array manufactured by GeneSiC Semiconductor. It features a common cathode configuration with two diodes in a single package. The device is rated for a maximum repetitive peak reverse voltage of 35V and supports an average forward rectified current of 100A per leg. It utilizes the TO-244AB chassis mount package, designed for high-power thermal management. The component exhibits a typical forward voltage drop of 700mV at full load current.
Diode Arrays Feature Summary
- Dual Schottky barrier rectifier structure with common cathode connection
- Chassis mount mechanical interface for direct heatsink attachment
- High surge current capability suitable for demanding power conversion loads
Diode Arrays Applications
- Industrial motor drive rectification stages
- DC-DC converter output filtering
- Battery charging system input protection
Diode Arrays Procurement Notes
Verify current availability status as supply may be restricted or discontinued. Confirm RoHS compliance details through official documentation before integration. Ensure mounting hardware matches the TO-244AB chassis specifications for proper thermal interface implementation.
Diode Arrays Selection Notes
Select this component when high current handling and low forward voltage drop are required in a compact dual-diode format. The chassis mount style necessitates specific PCB layout considerations for thermal dissipation compared to standard through-hole packages.
Diode Arrays Part Context
This part belongs to the GeneSiC semiconductor diode portfolio, specifically within the high-current Schottky rectifier category. It serves as a discrete solution for power electronics requiring robust reverse blocking capabilities and efficient conduction characteristics in industrial applications.
Diode Arrays Replacement Considerations
Public confirmed substitute part numbers are not available in the provided source data. Consult manufacturer documentation for cross-reference information if alternative sourcing is required.
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