MBRF30L60CTG

Diode Arrays Overview

The MBRF30L60CTG is a dual Schottky barrier rectifier in the TO-220FP (FullPak) package. It features a 60 V repetitive peak reverse voltage and a total average forward current of 30 A, with 15 A per diode leg. The device provides low forward voltage characteristics for high efficiency and includes guard-ring stress protection. Electrical specifications include a maximum instantaneous reverse current of 350 mA at rated DC voltage and 125°C case temperature.

Diode Arrays Feature Summary

• Dual common cathode configuration with integrated guard-ring for enhanced stress protection
• Low forward voltage design optimized for high efficiency and reduced power loss
• High surge capability supporting nonrepetitive peak currents up to 240 A

Diode Arrays Applications

• Power supply output rectification
• Power management systems
• Instrumentation circuits

Diode Arrays Procurement Notes

Verify the specific suffix 'G' confirms lead-free and RoHS compliance status. Confirm the package type matches the TO-220FP FullPak requirement rather than the standard TO-220 variant. Ensure thermal management aligns with the specified junction-to-case thermal resistance values provided in the datasheet.

Diode Arrays Selection Notes

Select this component when a dual Schottky rectifier with a 60 V rating and 30 A total capacity is required. The TO-220FP package offers distinct thermal performance compared to the standard TO-220 version. Verify that the operating junction temperature range of -55°C to +150°C meets the environmental requirements of the target application.

Diode Arrays Part Context

This part belongs to the MBR30L60CT series manufactured by onsemi. It is functionally identical to the MBR30L60CTG but utilizes the TO-220FP (Case 221D-03) package instead of the standard TO-220 (Case 221A). Both variants share the same electrical ratings and feature set.

Diode Arrays Replacement Considerations

The MBR30L60CTG serves as the direct lead-free replacement for the older MBR30L60CT model. Designers should verify that the PCB footprint accommodates the TO-220FP package dimensions if replacing the standard TO-220 version.

Diode Arrays FAQ

What is the difference between MBRF30L60CTG and MBR30L60CTG?

The primary difference is the package style. The MBRF30L60CTG uses the TO-220FP (FullPak) package, while the MBR30L60CTG uses the standard TO-220 package. They share identical electrical characteristics.

What is the maximum thermal resistance from junction to case?

For the MBRF30L60CTG, the maximum thermal resistance from junction to case is 5.0 °C/W.