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MBRT30020 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOTT 20V 150A 3TOWER. Review the specifications below when checking this part for your BOM.
The MBRT30020 is a silicon power Schottky diode module manufactured by GeneSiC Semiconductor. It features a three-tower package with an electrically isolated base plate and high surge capability. The device supports a repetitive peak reverse voltage of 20 V and an average forward current of 300 A per package. Key electrical characteristics include a maximum instantaneous forward voltage of 0.70 V at 150 A and a thermal resistance of 0.40 °C/W per leg. Operating and storage temperatures range from -55°C to 150°C.
Verify the specific suffix designation, as variants such as MBRT30020R exist with reversed leads. Confirm that the required voltage rating aligns with the 20 V specification rather than higher voltage siblings like the MBRT30030. Ensure thermal management solutions accommodate the specified junction-to-case thermal resistance for reliable operation within the stated temperature limits.
Select this component when a low forward voltage drop and high current capacity are required in a compact form factor. The isolated base plate simplifies heatsinking without additional insulators. Consider the MBRT30030 or higher if the circuit requires greater reverse voltage blocking capabilities while maintaining similar current ratings.
This part belongs to the MBRT300 series of silicon power Schottky diodes from GeneSiC Semiconductor. The series offers various voltage ratings ranging from 20 V to 40 V, all sharing the same 300 A current rating and three-tower package style. This family is designed for high-efficiency power conversion applications requiring fast switching and low conduction losses.
Direct replacements must match the 20 V rating and 300 A current capacity. Verify lead orientation, as the 'R' suffix indicates reversed leads compared to the standard MBRT30020. Cross-reference thermal resistance and package dimensions to ensure compatibility with existing board layouts and cooling systems.
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