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MBRT40040 is listed in the Diode Arrays range at ChipApex. The manufacturer field lists GeneSiC Semiconductor. Its product description is DIODE MOD SCHOTT 40V 200A 3TOWER. Review the specifications below when checking this part for your BOM.
The MBRT40040 is a silicon power Schottky diode module manufactured by GeneSiC Semiconductor. It features a Three Tower package with an electrically isolated base plate and supports screw mounting. The device provides a repetitive peak reverse voltage of 40 V and an average forward current of 400 A per package. Key electrical characteristics include a maximum instantaneous forward voltage of 0.70 V at 200 A, a maximum thermal resistance of 0.35 °C/W per leg, and a peak forward surge current of 3000 A. The operating junction temperature range spans from -55 °C to 150 °C.
Verify the specific part number suffix against official documentation to confirm terminal configuration details. Confirm that the component meets required isolation standards for the intended application environment. Ensure compatibility with existing thermal interface materials and mounting hardware specifications before procurement.
Select this component based on its 400 A current rating and 40 V blocking voltage requirements. Evaluate the 0.35 °C/W thermal resistance to ensure adequate heat sinking solutions are available. Consider the Three Tower package dimensions for PCB layout constraints and verify the operating temperature range suitability for the target system conditions.
This component belongs to the MBRT400 series of silicon power Schottky diodes. The series includes variants with different reverse voltage ratings ranging from 20 V to 40 V. All devices share the same Three Tower package structure and similar thermal characteristics, allowing for standardized mechanical designs across different voltage applications within the family.
Direct replacements must match the 400 A current rating, 40 V reverse voltage, and Three Tower package form factor. Verify equivalent thermal resistance and forward voltage characteristics to maintain circuit performance. Check terminal configurations to ensure mechanical compatibility without redesigning the mounting infrastructure.
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