MBRT50040R

Overview

The GeneSiC Semiconductor MBRT50040R is a silicon power Schottky diode module featuring a three-tower package with an electrically isolated base plate. It provides a repetitive peak reverse voltage of 40 V and supports an average forward current of 500 A per package. The device operates within a junction temperature range of -55 °C to 150 °C, with a maximum thermal resistance from junction to case of 0.30 °C/W per leg.

Feature Summary

• High surge capability
• Electrically isolated base plate

Applications

• Power conversion systems requiring high surge tolerance
• Applications utilizing three-tower isolation packages

Procurement Notes

Verify the specific datasheet for the MBRT50040R variant, as source documentation primarily details the MBRT50020 through MBRT50035 series. Confirm terminal configuration and lead orientation, noting that 'R' suffix devices typically feature reversed leads compared to standard versions. Ensure compatibility with required thermal management solutions given the specified thermal resistance values.

Selection Notes

Select this component for designs necessitating high average forward current handling alongside robust surge protection capabilities. The isolated base plate design facilitates mounting on insulated heat sinks or chassis without additional electrical isolation components. Verify that the 40 V reverse voltage rating aligns with the circuit's peak reverse voltage requirements under all operating conditions.

Part Context

This module belongs to the MBRT500 series of silicon power Schottky diodes manufactured by GeneSiC Semiconductor. The series utilizes a three-tower package architecture designed for high-current applications. The 'R' designation indicates a specific terminal configuration where the leads are reversed relative to the standard package layout.

Replacement Considerations

Cross-reference with other modules in the MBRT500 series, such as the MBRT50035R, if lower voltage ratings are acceptable. Ensure any substitute maintains the same three-tower package dimensions and electrical isolation characteristics to fit existing mechanical layouts.