MC100EL30DWG

Flip Flops Overview

The MC100EL30DWG is a triple D-type flip-flop from the onsemi 100 series, designed for high-speed ECL applications. It operates with a supply voltage range of 4.2 V to 5.7 V and features differential outputs with single-ended inputs. The device supports inverting and non-inverting polarities and exhibits a maximum propagation delay of 0.82 ns. It is housed in a 20-pin SOIC package and functions within an operating temperature range of -40°C to +85°C.

Flip Flops Feature Summary

• Triple D-type flip-flop configuration with differential outputs
• Supports both inverting and non-inverting output polarities
• High-speed operation with low propagation delay characteristics

Flip Flops Applications

• High-speed digital signal processing systems
• ECL-based clock distribution networks
• Data storage and transfer circuits requiring fast switching

Flip Flops Procurement Notes

Verify component authenticity through authorized distributors or direct manufacturer channels. Confirm RoHS compliance status as indicated in official documentation. Check for end-of-life notifications or discontinuance alerts prior to procurement. Ensure packaging specifications match design requirements. Validate lead times against current supply chain conditions.

Flip Flops Selection Notes

Select this component for designs requiring multiple synchronized D-type flip-flops in an ECL environment. Consider the 20-pin SOIC package for surface-mount assembly compatibility. Evaluate power consumption and thermal management needs given the 4.2V to 5.7V operating range. Ensure input signals are compatible with single-ended ECL levels.

Flip Flops Part Context

Part of the onsemi 100 series logic family, optimized for emitter-coupled logic (ECL) applications. Designed for high-frequency digital systems where speed and reliability are critical. Manufactured using advanced semiconductor processes to ensure consistent performance across industrial temperature ranges.

Flip Flops Replacement Considerations

Consult official cross-reference guides for verified substitutes. Verify pinout compatibility and electrical parameters before substitution. Check for equivalent propagation delays and supply voltage requirements. Confirm package dimensions match existing PCB footprints.