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MC100LVEL51DR2 is listed in the Flip Flops range at ChipApex. The manufacturer field lists onsemi. Its product description is IC FLIP FLOP DIFF CLK D 8-SOIC. Review the specifications below when checking this part for your BOM.
The MC100LVEL51DR2 is a 3.3V ECL differential clock D flip-flop manufactured by onsemi. It operates within a supply voltage range of 3 V to 3.8 V and features a propagation delay of 0.44 ns. The device provides one circuit with positive edge triggering in an 8-SOIC package. It supports a minimum operating temperature of -40°C and a maximum of +85°C, ensuring reliable performance across industrial temperature ranges for high-speed digital applications.
Verify component authenticity through authorized distributors. Confirm RoHS compliance status as historical records may vary. Check current lifecycle status since availability can fluctuate. Ensure storage conditions meet moisture sensitivity level requirements prior to assembly. Validate package marking against official datasheet specifications to prevent counterfeit substitution.
Select this component when differential ECL signaling is required for low-noise operation. Consider the 8-SOIC package constraints for PCB layout. Evaluate thermal management needs given the operational temperature range. Compare propagation delay specifications against system timing budgets. Verify power supply stability within the 3 V to 3.8 V window for optimal performance.
This part belongs to the MC100LVEL series of Low Voltage ECLinPS devices. It complements other logic gates and drivers in the same family. The series focuses on high-speed, low-power applications requiring precise timing. Compatible with standard ECL termination networks. Designed for integration into complex digital systems needing robust clock distribution.
MC100LVEL51DR2G is a verified lead-free variant with identical electrical characteristics. Both parts share the same functional pinout and performance metrics. Substitution requires verification of packaging suffix compatibility. Ensure environmental compliance requirements align with project specifications before swapping.
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