MC10EL31DTG

Flip Flops Overview

The MC10EL31DTG is a single D-type flip-flop from the onsemi 10EL series, designed for high-speed ECL applications. It operates with a supply voltage range of -4.2V to -5.7V and supports clock frequencies up to 2.8 GHz. The device features differential outputs and includes set and reset functions. Packaged in an 8-TSSOP surface-mount format, it ensures reliable performance across an industrial temperature range of -40°C to +85°C.

Flip Flops Feature Summary

• Supports high-speed data processing with a maximum clock frequency of 2.8 GHz
• Provides complementary differential outputs for signal integrity
• Integrates asynchronous set and reset control capabilities

Flip Flops Applications

• High-speed serial communication interfaces
• Data acquisition systems requiring precise timing
• Clock distribution networks within ECL logic families

Flip Flops Procurement Notes

Verify the specific suffix 'DTG' against official manufacturer documentation to confirm package type and compliance status. Ensure compatibility with existing -5V ECL power supplies and thermal management requirements for the TSSOP-8 footprint before finalizing procurement specifications.

Flip Flops Selection Notes

Select this component when differential signaling and low propagation delay are critical. Compare against the MC10EL31D variant if tube packaging is preferred over tape-and-reel. Confirm that the -4.2V to -5.7V operating range aligns with the system's negative voltage rails.

Flip Flops Part Context

This part belongs to the MC(10,100)EL31 family of D-type flip-flops. It shares functional similarities with the MC10EL31DG but utilizes a TSSOP-8 package instead of SOIC-8. The device is engineered for robust operation in demanding industrial environments while maintaining strict timing accuracy.

Flip Flops Replacement Considerations

The MC10EL31D serves as a pin-compatible alternative with identical electrical characteristics but differs in packaging (SOIC-8 vs. TSSOP-8). Verify board space constraints and soldering profiles when substituting between these package types.