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Product Detailed Parameters
- Description:IC MPU I.MX53 1GHZ 529FBGA
- Series:i.MX53
- Mfr:NXP USA Inc.
- Package:Tape & Reel (TR)
- Core Processor:ARM® Cortex®-A8
- Number of Cores/Bus Width:1 Core, 32-Bit
- Speed:1GHz
- Co-Processors/DSP:Multimedia; NEON™ SIMD
- RAM Controllers:LPDDR2, DDR2, DDR3
- Graphics Acceleration:Yes
- Display & Interface Controllers:Keypad, LCD
- Ethernet:10/100Mbps (1)
- SATA:SATA 1.5Gbps (1)
- USB:USB 2.0 (2), USB 2.0 + PHY (1), USB 2.0 OTG + PHY (1)
- Voltage - I/O:1.3V, 1.8V, 2.775V, 3.3V
- Operating Temperature:-20°C ~ 85°C (TC)
- Security Features:ARM TZ, Boot Security, Cryptography, RTIC, Secure Fusebox, Secure JTAG, Secure Memory, Secure RTC, Tamper Detection
- Mounting Type:Surface Mount
- Package / Case:529-FBGA
- Supplier Device Package:529-FBGA (19x19)
- Additional Interfaces:1-Wire, AC'97, I2C, I2S, MMC/SD, SAI, SPI, SSI, UART
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Overview
The MCIMX535DVP1C2R2 is an industrial-grade i.MX53 multimedia application processor featuring an ARM Cortex-A8 core operating at a maximum frequency of 800 MHz. It integrates a Neon SIMD coprocessor and VFPv3 vector floating-point unit. The memory architecture includes 32 KB L1 instruction cache, 32 KB L1 data cache, and a unified 256 KB L2 cache. External memory interfaces support DDR2-800, LVDDR2-800, LPDDR2-800, and DDR3-800 up to 2 GB. The device utilizes a TEPBGA-529 package with a 19x19 mm footprint and 0.8 mm pitch.
Feature Summary
- Integrated hardware accelerators including GPU3D for OpenGL ES 2.0 graphics and GPU2D for OpenVG 1.1 acceleration.
- Advanced security features comprising ARM TrustZone, Advanced High Assurance Boot (A-HAB), and tamper detection mechanisms.
- Comprehensive multimedia capabilities supported by a Video Processing Unit (VPU) and Image Processing Unit (IPU).
- Flexible connectivity options supporting dual displays, camera sensors, USB OTG, and multiple expansion card ports.
Applications
- Industrial embedded systems requiring robust multimedia processing
- Human-machine interface (HMI) applications in consumer electronics
- Medical market devices utilizing secure boot and display controllers
Procurement Notes
Verify the specific silicon revision and ordering suffix against official NXP documentation before procurement. Confirm that the TEPBGA-529 package dimensions and pin assignments match the target PCB layout. Ensure compliance with RoHS standards and moisture sensitivity level requirements during storage and assembly processes.
Selection Notes
Select this component when high-tier portable application performance is required alongside low power consumption via Dynamic Voltage and Frequency Scaling. Consider the integrated multimedia accelerators and extensive peripheral set for designs needing direct connections to WLAN, Bluetooth, GPS, or hard drives without additional bridge controllers.
Part Context
This part belongs to the i.MX53xD family of industrial products, succeeding the i.MX51 series. It offers improved performance, power efficiency, and multimedia capabilities compared to its predecessor. The processor serves as the central application chipset, providing all necessary interfaces for connecting various peripherals in complex system-on-chip designs.
Replacement Considerations
MCIMX537CVP8C2
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