MCT66XSMT&R

Transistor, Photovoltaic Output Optoisolators Overview

The MCT66XSMT&R is a dual-channel optocoupler manufactured by Isocom Components 2004 LTD. It features transistor outputs with a maximum output voltage of 30V and a continuous output current of 50mA per channel. The device provides an isolation voltage of 5300Vrms. The typical current transfer ratio is 6% at a forward current of 10mA. It operates within a temperature range of -55°C to 100°C and is housed in an 8-pin surface mount package.

Transistor, Photovoltaic Output Optoisolators Feature Summary

• Dual-channel configuration for independent signal isolation
• High isolation voltage rating for safety separation
• Transistor output type suitable for digital switching

Transistor, Photovoltaic Output Optoisolators Applications

• Digital signal isolation in industrial control systems
• Microcontroller interface circuits requiring galvanic isolation
• Power supply feedback loops

Transistor, Photovoltaic Output Optoisolators Procurement Notes

Verify the specific suffix 'SMT&R' confirms the tape and reel packaging format required for automated assembly processes. Confirm that the manufacturer designation matches Isocom Components 2004 LTD, as this part number may be associated with other manufacturers using similar naming conventions. Ensure the component meets the required moisture sensitivity level for the intended manufacturing environment.

Transistor, Photovoltaic Output Optoisolators Selection Notes

Select this component when dual-channel isolation is required in a compact surface-mount footprint. The 5300Vrms isolation rating supports high-voltage noise immunity applications. Verify that the 6% current transfer ratio meets the drive requirements of the receiving circuitry. Consider the 50mA output current capability for driving low-impedance loads directly.

Transistor, Photovoltaic Output Optoisolators Part Context

This component belongs to the MCT66 series of dual-channel optocouplers. It is functionally similar to the MCT66XG but differs in packaging, utilizing a surface mount form factor instead of through-hole DIP. The series is designed for general-purpose digital isolation tasks where space constraints favor SMD solutions over traditional DIP packages.

Transistor, Photovoltaic Output Optoisolators Replacement Considerations

Public confirmed substitute part numbers are not available in the provided documentation.