MD60C16D1-BP

Overview

The MD60C16D1-BP is a silicon diode module manufactured by Micro Commercial Components (MCC). It features a D1 package with screw mount installation. The device contains two diodes in series connection configuration. Key electrical parameters include a reverse voltage of 1.6 kV and a forward voltage of 1.3 V. The operational temperature range spans from -40 C to +150 C.

Feature Summary

• Dual diode structure integrated within a single power module housing
• Designed for high-voltage applications with 1.6 kV reverse blocking capability
• Utilizes screw mount mounting style for secure mechanical attachment

Applications

• Industrial power conversion systems
• High-voltage rectification circuits
• Power supply modules requiring robust thermal management

Procurement Notes

Verify the specific suffix BP against official MCC documentation to confirm exact binning or testing criteria, as suffixes can denote variations in forward voltage or leakage current specifications. Ensure the D1 package dimensions match your mechanical design constraints before ordering. Cross-reference the datasheet revision date to ensure compatibility with current manufacturing standards.

Selection Notes

Select this component when a dual-diode configuration is required in a compact power module form factor. The 1.6 kV rating suits medium-to-high voltage DC applications. Consider the 1.3 V forward voltage drop for thermal dissipation calculations. Verify that the screw mount interface aligns with your heatsink or busbar assembly requirements.

Part Context

This part belongs to the MD60C16D1 series of diode modules from Micro Commercial Components. These modules are designed for general-purpose power electronics applications. The series typically offers reliable performance in industrial environments. The D1 package provides a standardized footprint for easy integration into existing power designs.

Replacement Considerations

Check for direct substitutes within the MD60C16D1 family with different voltage ratings if system requirements change. Compare pinout and thermal characteristics with other D1 package modules from MCC or alternative manufacturers. Ensure any replacement maintains the same series connection configuration and screw mount compatibility.