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Product Detailed Parameters
- Description：DIODE MODULE GP 1600V 270A Y2DCB
- Series：-
- Mfr：IXYS
- Package：Box
- Diode Configuration：1 Pair Series Connection
- Technology：Standard
- Voltage - DC Reverse (Vr) (Max)：1600 V
- Current - Average Rectified (Io) (per Diode)：270A
- Voltage - Forward (Vf) (Max) @ If：1.4 V @ 600 A
- Speed：Standard Recovery >500ns, > 200mA (Io)
- Reverse Recovery Time (trr)：-
- Current - Reverse Leakage @ Vr：40 mA @ 1600 V
- Operating Temperature - Junction：-40°C ~ 150°C
- Mounting Type：Chassis Mount
- Package / Case：Y2-DCB
- Supplier Device Package：Y2-DCB
- Grade：-
- Qualification：-
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Overview
The IXYS MDD220-16N1 is a discrete semiconductor module featuring silicon technology and a Y2-DCB package. It provides a continuous forward current of 220 Amps with a peak reverse voltage of 1.6 kV. The forward voltage drop is specified at 1.4 V. The component supports screw mount installation and operates within a temperature range of -40 C to +150 C. This high-current diode module is designed for robust power applications.
Feature Summary
- High current capacity suitable for demanding power conversion tasks
- Robust thermal management via Y2-DCB packaging design
- Wide operating temperature range for diverse environmental conditions
Applications
- Industrial motor drives
- Power supply rectification
- Inverter circuits
Procurement Notes
Verify the obsolete status before procurement as the component is marked as discontinued by the manufacturer. Confirm availability through authorized distributors or secondary markets. Ensure compatibility with existing cooling systems due to the specific thermal requirements of the Y2-DCB package. Validate that the 220A rating meets the system's continuous load requirements without derating issues.
Selection Notes
Select this module when a 220A current rating and 1.6kV blocking voltage are required in a compact Y2-DCB form factor. Consider the 1.4V forward voltage for efficiency calculations in low-voltage, high-current applications. Evaluate the screw mount configuration against available mechanical mounting hardware. Compare thermal resistance characteristics with alternative packages if space constraints exist.
Part Context
This component belongs to the MDD220 series of high-current diode modules from IXYS. It utilizes standard silicon planar technology for reliable performance. The Y2-DCB package offers improved thermal conductivity compared to traditional epoxy encapsulations. It serves as a critical power switching element in medium to high-power industrial electronics.
Replacement Considerations
The MDD310-16N1 is a confirmed substitute part number offering higher current capacity. Verify pinout and mounting hole compatibility before substitution. Ensure the replacement module fits within the existing thermal envelope constraints.
