MDD310-08N1

Description：DIODE MODULE GP 800V 305A Y2-DCB
Series：-

SKU:1cbee9e8defd Category: Diode Arrays Brand: IXYS

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Product introduction

Product Detailed Parameters

Description：DIODE MODULE GP 800V 305A Y2-DCB
Series：-
Mfr：IXYS
Package：Box
Diode Configuration：1 Pair Series Connection
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：800 V
Current - Average Rectified (Io) (per Diode)：305A
Voltage - Forward (Vf) (Max) @ If：1.2 V @ 600 A
Speed：Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：40 mA @ 800 V
Operating Temperature - Junction：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Y2-DCB
Supplier Device Package：Y2-DCB
Grade：-
Qualification：-

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MDD310-08N1

Overview

The IXYS MDD310-08N1 is a high-power diode module featuring two parallel planar passivated chips on a direct copper bonded Al2O3-ceramic base plate. It provides an average forward current of 305 A at a case temperature of 100°C and supports a repetitive peak reverse voltage of 800 V. The device exhibits a maximum forward voltage of 1.2 V at 600 A and a junction-to-case thermal resistance of 0.129 K/W per diode under DC conditions. Rated for a maximum junction temperature of 150°C, it offers an isolation voltage of 3600 Vrms.

Feature Summary

Direct copper bonded Al2O3-ceramic base plate
Planar passivated chip technology
High isolation voltage rating

Applications

Supplies for DC power equipment
DC supply for PWM inverter
Field supply for DC motors
Battery DC power supplies

Procurement Notes

Verify the specific part number against official datasheets to confirm electrical ratings and physical dimensions. Ensure mounting torque specifications are strictly followed during installation to maintain thermal performance and mechanical integrity. Confirm compliance with relevant safety standards required for your specific application environment before finalizing procurement.

Selection Notes

Select this module based on its 800 V reverse voltage capability and 305 A average current rating at specified case temperatures. Evaluate thermal management requirements using the provided junction-to-case thermal resistance values. Consider the package type and mounting configuration to ensure compatibility with existing heatsink infrastructure and system constraints.

Part Context

This component belongs to the MDD310 series of high-power diode modules manufactured by IXYS. The series utilizes robust silicon planar passivation technology designed for demanding industrial applications. These modules are engineered to provide reliable performance in high-current rectification scenarios within power conversion systems.