MDD312-22N1

$134.43

Description：DIODE MODULE GP 2200V 310A Y1-CU
Series：-

SKU:7932be796629 Category: Diode Arrays Brand: IXYS

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Product introduction

Product Detailed Parameters

Description：DIODE MODULE GP 2200V 310A Y1-CU
Series：-
Mfr：IXYS
Package：Box
Diode Configuration：1 Pair Series Connection
Technology：Standard
Voltage - DC Reverse (Vr) (Max)：2200 V
Current - Average Rectified (Io) (per Diode)：310A
Voltage - Forward (Vf) (Max) @ If：1.32 V @ 600 A
Speed：Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr)：-
Current - Reverse Leakage @ Vr：30 mA @ 2200 V
Operating Temperature - Junction：-40°C ~ 150°C
Mounting Type：Chassis Mount
Package / Case：Y1-CU
Supplier Device Package：Y1-CU
Grade：-
Qualification：-

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MDD312-22N1

Overview

The MDD312-22N1 is a high voltage standard rectifier module manufactured by IXYS. It features an international standard package with direct copper bonded Al2O3 ceramic and a copper base plate. The device utilizes planar passivated chips and provides an isolation voltage of 3600 V~.

Feature Summary

Direct Copper Bonded Al2O3 ceramic with copper base plate
Planar passivated chips
Isolation voltage 3600 V~

Applications

Supplies for DC power equipment
DC supply for PWM inverter
Field supply for DC motors
Battery DC power supplies

Procurement Notes

Verify the specific electrical ratings, particularly the repetitive peak reverse voltage and forward current, against the official IXYS datasheet before procurement. Confirm that the package style and mounting requirements align with the target application design to ensure proper integration and thermal management.

Selection Notes

Select this component for applications requiring robust high-voltage rectification with improved temperature and power cycling capabilities. The simple mounting design and reduced protection circuit requirements make it suitable for industrial power systems where reliability under thermal stress is critical.

Part Context

This module belongs to the MDD312 series of high voltage standard rectifier modules from IXYS. The series is characterized by its use of planar passivated chips and direct copper bonding technology, designed for demanding power conversion environments.