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MEC1609I-PZP is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists Microchip Technology. Its product description is MIXED SIGNAL MOBILE EMBEDDED CON. Review the specifications below when checking this part for your BOM.
The MEC1609i-PZP is a mixed-signal mobile embedded Flash ARC EC base component manufactured by Microchip Technology. It features an ARC-625D 32-bit embedded controller with 192 KB of user Flash memory, 16 KB of dual-ported SRAM, and a 2 KB instruction cache. The device operates at 3.3V and supports the LPC interface for host communication. It includes three SMBus 2.0 controllers, PECI 2.0, PS/2 ports, and an ADC interface. The industrial temperature variant (-40°C to +85°C) is housed in a 144-pin LFBGA package.
Verify that the suffix 'i' corresponds to the industrial temperature range of -40°C to +85°C. Confirm the 'PZP' suffix indicates the 144-pin LFBGA package. Ensure the specific revision of the datasheet DS00001769A matches the silicon revision required for the design.
Select the MEC1609i over the MEC1609 when operation below 0°C is required. The PZP package is a 144-pin LFBGA (10mm x 10mm). Verify system requirements for LPC interface decoding and VLPC companion component compatibility before finalizing the selection.
The MEC1609i is part of the MEC1609 family, serving as the base component for advanced I/O controller architectures. It utilizes the BC-Link and VLPC protocols to communicate with companion components. The device integrates significant on-chip memory and processing power to handle system management tasks independently.
The standard commercial version MEC1609-PZP offers identical functionality but operates within the 0°C to +70°C temperature range. No other direct cross-model replacements are documented in the provided source material.
The device operates at 3.3V.
It contains 192 KB of user space Flash memory plus a 2 KB info block.
Yes, it features an LPC interface that decodes LPC I/O and Trusted Cycles.
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