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MF3DH8200DA4/01J is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MIFARE DESFIRE EV2 PLMCC. Review the specifications below when checking this part for your BOM.
The MF3DH8200DA4/01J is an MIFARE DESFire EV2 contactless multi-application IC featuring 8 kbit non-volatile memory and a high input capacitance of 70 pF. It operates at 13.56 MHz with data rates up to 848 kbit/s, compliant with ISO/IEC 14443 Type A. The device includes hardware AES and 3DES engines, Common Criteria EAL5+ certification, and supports flexible file structures with transaction-oriented anti-tear mechanisms. Packaged in the MOA-4 leadless module carrier (SOT500-2), it enables secure access for smart city and payment applications.
Verify component status as the MF3DH8200DA4/01J is listed as No Longer Manufactured. Confirm availability through authorized distributors or secondary markets. Ensure compatibility with existing reader infrastructure before procurement, considering potential obsolescence impacts on long-term deployment cycles.
Select this variant for designs requiring small form factors due to the 70 pF high input capacitance specification. The MOA-4 package suits surface-mount assembly. Verify that the 8 kbit storage capacity meets application requirements for multiple files and applications. Ensure reader support for ISO/IEC 14443 Type A and DESFire EV2 commands.
This part belongs to the MF3D(H)x2 series, representing the third generation of MIFARE DESFire products. It succeeds the DESFire EV1 and D40 models, offering backward compatibility while introducing features like Virtual Card Architecture and Transaction MAC. The 'H' designation specifically indicates the 70 pF input capacitance option for compact antenna designs.
Public confirmed substitute part numbers are not available in the provided documentation. As the component is discontinued, engineers should evaluate the MIFARE DESFire EV3 series (e.g., MF3DH9300DA4) for new designs, noting differences in memory size and feature sets.
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