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MF3DH8201DUF/01V is listed in the Application Specific Microcontrollers range at ChipApex. The manufacturer field lists NXP USA Inc.. Its product description is IC MIFARE DESFIRE EV2 FFC. Review the specifications below when checking this part for your BOM.
The MF3DH8201DUF/01V is a MIFARE DESFire EV2 contactless multi-application IC from NXP Semiconductors. It features 8 kbit non-volatile memory and an input capacitance of 70 pF, optimized for small form factor designs. The device operates at 13.56 MHz with data rates up to 848 kbit/s. It includes hardware AES and 3DES engines, achieving Common Criteria EAL5+ certification. Delivered as a sawn die on film frame carriers, it supports flexible file structures and advanced security protocols.
Verify the specific suffix 'V' against official documentation, as standard datasheets list 'MF3DH8201DUF/01'. Confirm wafer thickness specifications (75 μm) and film frame carrier delivery format. Ensure compatibility with SAWN die handling processes during assembly.
Select this variant when small form factor constraints require higher input capacitance (70 pF). It provides backward compatibility with existing MIFARE DESFire EV1 infrastructure while enabling new features like Transaction MAC and Virtual Card Architecture. Suitable for applications requiring high security levels and flexible application management.
Part of the MF3D(H)x2 family, succeeding the MIFARE DESFire EV1. It maintains functional backward compatibility with older generations while introducing enhanced cryptographic methods and unlimited application support. Designed for service providers needing secure, interoperable contactless transaction solutions.
Functionally compatible with MF3DH8201DUD/01 but differs in package type (wafer vs. module). Verify if the 'V' suffix indicates a specific revision or regional variant not explicitly detailed in the primary short data sheet.
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