— IC芯片 | 连接器 | 传感器 | 被动器件 —
Product Detailed Parameters
- Description:MIMX8QX5CVLFZAC
- Series:-
- Mfr:NXP USA Inc.
- Package:Tray
- Core Processor:-
- Number of Cores/Bus Width:-
- Speed:-
- Co-Processors/DSP:-
- RAM Controllers:-
- Graphics Acceleration:-
- Display & Interface Controllers:-
- Ethernet:-
- SATA:-
- USB:-
- Voltage - I/O:-
- Operating Temperature:-
- Security Features:-
- Mounting Type:Surface Mount
- Package / Case:609-BFBGA
- Supplier Device Package:609-FBGA (21x21)
- Additional Interfaces:-
- Grade:-
- Qualification:-
Download product information
Overview
The MIMX8QX5CVLFZAC is an NXP Semiconductors i.MX 8QuadXPlus application processor featuring a five-core architecture with four ARM Cortex-A35 cores and one ARM Cortex-M4F core. It utilizes a 64-bit data bus and operates within a temperature range of -40°C to +125°C. The device supports DDR3L, LPDDR4, and SRAM storage types via interfaces including PCIe, USB 3.0 OTG, MIPI-CSI, and MIPI-DSI. Core clock frequencies reach up to 1.2 GHz for the A35 and 264 MHz for the M4F. It employs a 609-ball FCBGA package.
Feature Summary
- Integrates heterogeneous processing capabilities combining high-performance Cortex-A35 cores for complex operating systems with a real-time Cortex-M4F core for safety-critical tasks.
- Provides extensive multimedia connectivity through dedicated MIPI interfaces for camera and display subsystems alongside multiple serial communication protocols.
- Supports advanced industrial and automotive environments with extended temperature ratings and robust hardware security features including secure boot and encryption engines.
Applications
- Industrial automation and control systems
- Automotive infotainment and instrument clusters
- Commercial IoT gateways
Procurement Notes
Verify the specific suffix CVLFZAC against official NXP documentation to confirm pinout compatibility and feature set. Ensure the procurement channel provides valid RoHS compliance certificates. Confirm that the supplier handles moisture sensitivity level requirements appropriately during shipping and storage to prevent package damage before soldering.
Selection Notes
Select this component when a balance between multi-core processing power and real-time control is required for industrial or automotive applications. Consider the 609-ball FCBGA package constraints and thermal management needs for operation at temperatures up to 125°C. Evaluate memory interface support for LPDDR4 or DDR3L based on system bandwidth requirements.
Part Context
This part belongs to the i.MX 8X family, designed for scalable edge computing solutions. It shares architectural similarities with other members like the MIMX8DX5AVLFZAC but offers distinct core configurations and interface options tailored for specific performance tiers within the broader NXP embedded processor portfolio.
Replacement Considerations
Consult official NXP substitution guides for verified alternatives. Cross-referencing with similar i.MX 8QuadXPlus variants requires checking package dimensions and electrical specifications to ensure mechanical and functional compatibility without redesigning the host board.
FAQ
What is the maximum operating temperature for this processor?
The MIMX8QX5CVLFZAC supports a maximum junction temperature of +125°C, suitable for industrial and automotive environments.
Which external memory types are supported by this model?
The processor supports DDR3L, LPDDR4, and SRAM as external memory storage types.
ChipApex | Global Electronic Components Supplier







