MIMX8UD5DVK08SC

MIMX8UD5DVK08SC

$10.44
  • Description:I.MX8ULP,DUAL 800MHZ
  • Series:i.MX8ULP
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:14b344d8c8f4 Category: Brand:

  
  • Quantity
    • -
    • +
  •    
ChipApex WhatsApp

Consult the customer manager about the wholesale price.

consultation hotline:86-132-6715-2157

email:[email protected]
Contact the product manager for consultation. One-stop consultation is available.


Do you want a lower wholesale price? Please send us your inquiry and we will reply immediately.

Submitting!
Submission successful!
Submission failed!
Email error!
Phone number error!

Product Detailed Parameters

  • Description:I.MX8ULP,DUAL 800MHZ
  • Series:i.MX8ULP
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A35
  • Number of Cores/Bus Width:2 Core, 64-Bit
  • Speed:800MHz
  • Co-Processors/DSP:3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
  • RAM Controllers:LPDDR3, LPDDR4
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:MIPI-CSI, MIPI-DSI
  • Ethernet:10/100Mbps
  • SATA:-
  • USB:USB 2.0 (2)
  • Voltage - I/O:-
  • Operating Temperature:0°C ~ 95°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:512-VFBGA
  • Supplier Device Package:512-VFBGA (9.4x9.4)
  • Additional Interfaces:I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
  • Grade:-
  • Qualification:-

Download product information

MIMX8UD5DVK08SC

Overview

The NXP MIMX8UD5DVK08SC is an i.MX 8ULP crossover application processor featuring dual Arm Cortex-A35 cores at 800 MHz and a Cortex-M33 core at 216 MHz. It integrates a Cadence Tensilica HiFi4 DSP up to 600 MHz, a Fusion DSP, and a 3D/2D GPU. The device supports LPDDR3/LPDDR4/LPDDR4x memory interfaces and includes EdgeLock secure enclave security. Packaged in a 9.4 mm x 9.4 mm FCBGA with 0.4 mm pitch, it operates within a commercial temperature range of 0°C to +95°C.

Feature Summary

  • Heterogeneous multi-core architecture combining high-performance application processing with real-time control capabilities
  • Integrated EdgeLock secure enclave providing hardware-based root of trust and cryptographic acceleration
  • Specialized low-power audio and machine learning processing via dedicated Tensilica DSPs
  • Advanced power management subsystem supporting multiple ultra-low power modes for energy efficiency

Applications

  • Smart home control systems
  • Wearable devices
  • Industrial IoT sensors
  • Voice-enabled edge nodes

Procurement Notes

Verify the specific silicon revision and package marking against the official NXP data sheet before integration. Confirm that the ordering suffix matches the required commercial temperature grade and pinout configuration. Ensure compatibility with the intended power management IC and external memory components as specified in the reference design guidelines.

Selection Notes

Select this component when a balance of rich OS execution and real-time deterministic control is required in a compact form factor. The integrated graphics and DSP capabilities make it suitable for applications needing local AI inference or voice interaction without external accelerators. Consider the FCBGA package constraints for PCB layout and thermal management during the design phase.

Part Context

This part belongs to the i.MX 8ULP family, designed for ultra-low power edge computing. It utilizes NXP's Energy Flex architecture to optimize performance per watt. The series targets smart edge devices requiring robust security and multimedia processing in battery-powered or energy-constrained environments.

Replacement Considerations

Check for compatible variants within the i.MX 8ULP series such as MIMX8UD3DVK08SC or MIMX8US3DVK08SC, which may offer different memory configurations or feature sets while maintaining pin compatibility.

MIMX8UD5DVK08SCMIMX8UD5DVK08SC
$10.44
Buy Now