MIMX8UD7DVK08SC

MIMX8UD7DVK08SC

$10.75
  • Description:I.MX8ULP,DUAL 800MHZ
  • Series:i.MX8ULP
  • Mfr:NXP USA Inc.
  • Package:Tray

SKU:de457e304a5a Category: Brand:

  
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Product Detailed Parameters

  • Description:I.MX8ULP,DUAL 800MHZ
  • Series:i.MX8ULP
  • Mfr:NXP USA Inc.
  • Package:Tray
  • Core Processor:ARM® Cortex®-A35
  • Number of Cores/Bus Width:2 Core, 64-Bit
  • Speed:800MHz
  • Co-Processors/DSP:3D GPU, ARM® Cortex®-M33, Hi-Fi4 DSP
  • RAM Controllers:LPDDR3, LPDDR4
  • Graphics Acceleration:Yes
  • Display & Interface Controllers:MIPI-CSI, MIPI-DSI
  • Ethernet:10/100Mbps
  • SATA:-
  • USB:USB 2.0 (2)
  • Voltage - I/O:-
  • Operating Temperature:0°C ~ 95°C (TJ)
  • Security Features:-
  • Mounting Type:Surface Mount
  • Package / Case:512-VFBGA
  • Supplier Device Package:512-VFBGA (9.4x9.4)
  • Additional Interfaces:I2C, I2S, MMC/SD/SDIO, SPDIF, SPI, TDM, UART, USB
  • Grade:-
  • Qualification:-

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MIMX8UD7DVK08SC

Overview

The NXP MIMX8UD7DVK08SC is an i.MX 8ULP commercial-grade application processor featuring dual Arm Cortex-A35 cores at 800 MHz and a Cortex-M33F core at 216 MHz. It integrates a Cadence Tensilica HiFi4 DSP (up to 600 MHz) for advanced audio and machine learning, alongside a Fusion DSP for low-power voice tasks. The device includes a 3D GPU supporting OpenGL ES 3.1 and Vulkan 1.1, plus a 2D composition core. Security is provided by the EdgeLock secure enclave with AHAB boot support. Memory interfaces include LPDDR3/4/4x and Octal SPI. It utilizes a 9.4 x 9.4 mm FCBGA package with a 0.4 mm pitch, rated for temperatures from 0°C to +95°C.

Feature Summary

  • Heterogeneous multi-core architecture combining high-performance Linux execution on Cortex-A35 with real-time control on Cortex-M33.
  • Integrated EdgeLock secure enclave providing hardware-rooted security with Advanced High Assurance Boot (AHAB).
  • Specialized audio and AI processing via dedicated Tensilica HiFi4 and Fusion DSPs.
  • Energy Flex architecture with a RISC-V based uPower subsystem for dynamic voltage and frequency scaling.

Applications

  • Smart home control systems
  • Wearable devices
  • Voice-enabled IoT endpoints

Procurement Notes

Verify the specific suffix 'VK' confirms the 9.4 x 9.4 mm FCBGA package and commercial temperature range. Ensure compatibility with required external memory types (LPDDR3/4/4x) and flash configurations. Confirm silicon revision status and check for any applicable chip errata relevant to the design implementation before finalizing procurement.

Selection Notes

Select this part for applications requiring simultaneous rich OS execution and deterministic real-time performance in a compact form factor. The inclusion of specialized DSPs makes it suitable for always-on voice interaction and edge AI inference. Consider the FCBGA package constraints and thermal requirements for dense PCB layouts.

Part Context

This component belongs to the i.MX 8ULP family, designed for ultra-low power smart edge applications. It shares the Energy Flex architecture with other series members but offers specific core counts and interface options tailored for cost-sensitive consumer and industrial IoT devices.

Replacement Considerations

Check for pin-compatible alternatives within the i.MX 8ULP series such as MIMX8UD5DVK08SC or MIMX8UD3DVK08SC, which may offer different fusing options or silicon revisions while maintaining the same package and core configuration.

FAQ

What operating systems are supported by the dual-core architecture?

The Cortex-A35 cores typically run rich operating systems like Linux, while the Cortex-M33 core runs real-time operating systems such as FreeRTOS.

How does the EdgeLock secure enclave enhance security?

It provides a Root of Trust with dedicated boot ROM, ECDSA signature verification, and cryptographic acceleration, ensuring secure boot and protected storage.

MIMX8UD7DVK08SCMIMX8UD7DVK08SC
$10.75
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